Apple Shifted To TSMC For New Apple Chips
TSMC has reportedly started trial manufacturing of Apple's next generation A6 chips shifting from its traditional chip supplier, Samsung Electronics. The report was released today...
Semiconductor Firms and SEMATECH to Develop Metrology Tools for Extreme Ultraviolet Lithography Masks
GLOBALFOUNDRIES, Intel, TSMC, and Samsung Electronics have joined SEMATECH's EMI partnership to build metrology devices for detecting defects in advanced masks suitable for extreme ultraviolet...
AMD to Contract TSMC, GlobalFoundries For 28nm Chips
AMD has reportedly agreed with Taiwan Semiconductor Manufacturing Co. (TSMC) as its primary contract supplier of 28nm Krishna/Wichita microprocessors early next year and GlobalFoundries as...
TSMC Completes 28nm Design Infrastructure
TSMC announced today that 28nm support within the Open Innovation Platform (OIP) design infrastructure is fully delivered, as demonstrated by 89 new 28nm designs scheduled...
TSMC Joins SEMATECH to Accelerate Research and Development on 20nm Technologies
TSMC joined SEMATECH as a core member, in an effort to focus on advanced technology development to address some of the industry's most pressing challenges...
Cadence and TSMC to Deliver DFM Services for TSMC Advanced Processes
Cadence Design Systems, Inc. has collaborated with TSMC to deliver their customers DFM expertise and technology in a service model. In an effort to reduce...
TSMC to Initiate 20nm Production Next Year
Taiwan Semiconductor Manufacturing Co. (TSMC) plans to start pilot production of its advanced 20nm process in the second half of 2012, as a first step...
Apple Reportedly Ties With TSMC On iPad2 Processor
Apple is reportedly expanding their foundry ties with Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) for the production of the processors of the iPad 2. Citing...
TSMC To Move in Bigger Wafers
Taiwan Semiconductor Manufacturing Company said on Thursday that it plans to have a trial production line using 18-inch wafers ready by 2013 or 2014, in...
TSMC and Spreadtrum Communications Produce First 40nm Baseband Chip For China's 3G Standard
Fabless semiconductor company Spreadtrum Communications and TSMC today unveiled their achievement on the first commercialized 40nm Time Division - Synchronous Code Division Multiple Access (TD-SCDMA)...
