Toshiba Image Recognition SoC for Autos Integrates a Deep Neural Network Accelerator
Toshiba has developed a new image recognition SoC for automotive applications that implements deep learning accelerator at 10 times the speed and 4 times the...
ISSCC 2019: Toshiba Desribes 96-layer, 1.33Tb 3D NAND Chip, AI Chip
Interesting papers presented so far at the International Solid State Circuits Conference include Toshiba Memory's 96-layer, 1.33Tb 3D NAND chip and Samsung's new neural network...
Intel Shows Collaborative Mini-Bots, Brain-Inspired Computers and 5G at ISSCC 2019
Intel is presenting at ISSCC 2019 a series of innovations – from 5G networks to intelligent edge systems and robotic systems.
The International Solid-State...
Japanese Researchers Design 3mm Transceiver for 5G Communications
Researchers at Tokyo Tech have designed a very small 28 GHz transceiver that integrates beamforming with dual-polarized multiple-input and multiple-output (MIMO) technology.
Measuring just...
ISSCC 2019: Panasonic Introduces 80 Gbps Terahertz Wireless Tranceiver
Hiroshima University, National Institute of Information and Communications Technology, and Panasonic announced the development of a terahertz (THz) transceiver that can transmit or receive digital...
ISSCC 2019 is Focusing on Memory, AI and 5G
This year’s International Solid-State Circuits Conference (ISSCC) inludes paper presentations related to 5G/LTE, machine learning, NAND and DRAM memories, rather than advancements in Silicon IC...
Advances In Semiconductor Technology On Display At The ISSCC
At the International Solid State Circuits Conference (ISSCC), Samsung and TSMC will describe 7nm SRAMs, Mediatek will show a 10nm SoC and STMicroelectronics will unveil...
ISSCC To Highlight Future Chip Advancements
The 2016 IEEE international Solid-State Circuits Conference (ISSCC) will kick off Jan. 31 in San Francisco, CA, and technology giants will present papers describing the...
