LG Innotek is seeking to take the lead in 3D sensing modules, which will become major components for premium smartphones, the electronics components manufacturing affiliate...

A KAIST research team developed a silicon optical phased array (OPA) chip, which can be a core component for three-dimensional image sensors.

This research...

LG Electronics and Infineon Technologies AG have teamed up to introduce Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over.

LG says that Infineon’s...

Apple plans to launch iPhones with powerful 3-D cameras as soon as next year, stepping up the company’s push into augmented reality.

According to Bloomberg,...

Sony, the biggest maker of camera chips used in smartphones, is boosting production of next-generation 3D sensors after getting interest from customers including Apple.

According...

Huawei Technologies Co. is reportedly planning to unveil a new phone with a camera capable of taking three-dimensional pictures.

Bloomberg reports that the phone, code-named...

The rear triple...