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Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure

Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure

Enterprise & IT Jul 8,2026 0

Samsung Electronics a global leader in advanced memory technology, today announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid state drive (SSD) optimized for next-generation AI and HPC server environments.

As the volume of data required for AI training and inference continues to grow rapidly, enterprise SSDs (eSSDs) capable of delivering data quickly and reliably are becoming increasingly essential to AI infrastructure.

Featuring high-speed data transfer and an optimized controller architecture, PM1763 is expected to serve as a key storage solution for high-performance AI platforms.

“Built on industry-leading performance, PM1763 has successfully completed validation for next-generation AI platforms and is well positioned to support evolving AI infrastructure requirements,” said Jangseok Choi, Vice President and Head of Memory Product Planning at Samsung Electronics. “As AI models continue to grow in size and complexity, PM1763 will serve as a key solution that enables customers to efficiently scale memory capacity and optimize AI operations.”

Incorporating Samsung’s 9th-generation V-NAND and a newly developed 4-nanometer (nm) controller, PM1763 significantly improves both performance and power efficiency.

PM1763 is available in 4-terabyte (TB), 8TB and 16TB capacities, with the 16TB configuration delivering industry-leading performance with sequential read and write speeds of up to 28,400 megabytes-per-second (MB/s) and 21,900MB/s, respectively — more than 2 times the performance of its predecessor, PM1753.

This level of performance allows the transfer of a 40-gigabyte (GB) large language model (LLM) in approximately 1.4 seconds, helping minimize data latency between processors and accelerators while improving overall AI processing efficiency.

PM1763 is optimized for liquid-cooled server environments through direct-to-chip (D2C) cooling technology. This enables sustained peak performance even under intensive workloads and extended operating conditions.

Power efficiency is also improved by more than 1.8 times compared to its predecessor, helping reduce overall datacenter operating costs.

To address growing security requirements in AI, Samsung has also strengthened PM1763’s security capabilities. The drive supports post-quantum cryptography (PQC) algorithms designed to protect against future quantum computing threats, as well as TEE Device Interface Security Protocol (TDISP),1 which helps secure data pathways in virtualized environments.

Tags: Samsung Electronics
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