New Gpoup Simplifies Flash NAND Integration
Hynix Semiconductor, Intel Corporation, Micron Technology, Phison Electronics Corporation and Sony Corporation are among the founding companies that today announced the formation of the Open...
New 3D Memory Package Improves Performance Using Less Space
Samsung announced today that it has developed a new stacking technology for semiconductior chips, which offer a small footprint and improved overall performance. The Korean...
Toshiba, SanDisk to Build new NAND Flash Memory Facility
Toshiba and SanDisk said in a joint statement they have agreed to build a new 300-millimeter wafer fabrication facility to meet fast growing demand for...
Samsung Begins Mass Production of 70nm NAND Memory
Samsung announced Monday that it is now mass producing 70nm 1Gb OneNAND. The higher-speed memory is targeted toward a wide range of applications beyond mobile...
Toshiba Wins Flash Memory Patent Suit Against Hynix
The Japanese unit of South Korea's Hynix Semiconductor Inc. was ordered on Friday to halt its NAND flash memory sales in Japan in a lawsuit...
Intel, Micron to Form NAND Joint Venture
Micron Technology and Intel have agreed to form a new company to manufacture NAND flash memory for use in consumer electronics, while they will be...
Samsung In Talks with Apple for Long-term Chip Deal - Again
Samsung said Wednesday it is in talks with Apple Computer to supply NAND flash memory chips on a long-term basis. The Korean company didn't provide...
