The Kingmax Group, formed in Taiwan in 1989, set a division of labor by creating a number of companies: Kingmax Semiconductor Inc., which produces and markets memory products; Kingpak Technology, which specializes in package testing and PCBA production; and Kingmax Digital, which produces and markets flash memory products.

We received from Kingmax its DDRII 667 memory modules from the Mars series, which is embedded with a red ASIC decoder chip and the company's proprietary TinyBGA color packaging technology. This new Kingmax memory product is 100% counterfeit-proof, according to the manufacturer and symbolizes the fiery, strong heart of Mars, the god of war :-)

In terms of technical specifications, the Mars DDRII 667 is endowed with up to 8.6GB/s of memory bandwidth and fully supports Prescott/Tejas 1067MHz FSB while direct integration of ODT technology increases system stability. With a low 1.8 volts of working voltage that cuts power consumption by 50%, the Mars DDRII 667 can run at JEDEC standard 4-4-4-12 latency timings, making it the perfect support for all new-generation DDRII high-speed computers. Just as DDR has replaced SDRAM, DDRII -with its new specifications and powerful functions- will soon replace current DDR specifications as the market mainstream.

Each module comes in a box with a simple guide for the user.

KINGMAX has developed high-tech anti-counterfeiting measures to protect the rights of end-users by adding to each DDR2 memory module a red ASIC decoder chip, which uses Kingmax's TinyBGA "color compound" packaging technology.

Packaging technology, in particular, determines a memory module’s working stability. Currently, most DDRs and SDRAMs use the TSOP packaging method, but BGA packaging is mandatory for DDRII according to JEDEC standards. With BGA packaging, there is a wider space at the bottom of the chip, which allows for a higher pin count while guaranteeing larger spacing between pins and meets the higher density signal input/output requirements essential for DDRII. Furthermore, BGA packaging offers other advantages, such as easy chip installation, better electrical performance, less delay in signal transmission, which allow for high-frequency operation and excellent heat dispersion.

Kingmax developed BGA packaging technology eight years ago and has successfully utilized it in the mass production of its SDRAM and DDR products. This proprietary patented technology – TinyBGA-- is highly recognized in the industry. Kingmax has used this cutting-edge technology since the SDRAM PC66/100 era, when it was used only with high-end semiconductor products (e.g. CPU). With over eight years of experience, Kingmax is extensively equipped to handle the exacting challenges faced in BGA packaging, including technical expertise, equipment upgrades and personnel training.

Features

- 240-pin, DDRII memory module.
- Voltage: 1.8V, reducing power consumption by approximately 50%
- Memory signal termination inside the memory chip ("On-Die Termination") to prevent reflected signal transmission errors.
- Operational enhancements to increase memory performance, efficiency and timing margins.
- Great heat dissipation capabilities
- Exceptional memory functionality and efficiency.
- Global lifetime warranty.
- Bi-directional data strobe (DQS-DQS#)
- Differential clock inputs (CK and CK#)
- DLL aligns DQ and DQS transition with CK transition
- Auto & self refresh capability (8192 Cycles / 64ms)
- Double-data-rate architecture; two data transfers per clock cycle
- Programmable Read latency : 3, 4 and 5 (clock)
- Programmable Additive Latency: 0, 1, 2, 3 and 4
- Programmable Burst length:G4 or 8
- Programmable Burst type (Sequential & Interleave)
- Edge aligned data output, center aligned data input
- Serial presence detect with EEPROM