Friday, November 24, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Foundry in Advanced Discussions With New Customers for 7nm Chips
Tesla Finished Installing the World's Largest Mega-battery in Australia Within 100 Days
Apple Applies for Patent on Foldable Display
HP Patches Code execution Bug in Enterprise Printers
YouTube Takes More Steps to Tackle Down Videos Inappropriate for Minors
Broadcom Considering Increasing Qualcomm Bid
Facebook Will Notify you if you Have Followed Russian Propaganda
Russia Threatens to Block Ads on Google
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC Ta...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, October 12, 2012
TSMC Tapes Out First CoWoS Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface


TSMC today announced that it has taped out the first CoWoS (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface.

This new generation of TSMC's CoWoS test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component. Along with Wide I/O mobile DRAM, the integrated chips provide optimized system performance and a smaller form factor with improved die-to-die connectivity bandwidth.

CoWoS is an integrated process technology that attaches device silicon chips to a wafer through chip on wafer (CoW) bonding process. The CoW chip is attached to the substrate (CoW-On-Substrate) to form the final component. TSMC CoWoS technology has entered the pilot production stage.

TSMC worked with SK Hynix, Cadence Design Systems and Mentor Graphics to deliver the tape-out.

"Silicon validation is a critical step in the development of a highly advanced and complete CoWoS design solution," said Cliff Hou , Vice President of Research and Development at TSMC. "The successful demonstration of the JEDEC Wide I/O mobile DRAM interface highlights the significant progress TSMC and its ecosystem partners have made to capitalize on the performance, energy efficiency and form factor advantages of CoWoS technology."

In seperate news, TSMC is currently seen to be the sole 20nm process supplier to Apple quad-core processors.

Citigroup Global Markets' market research fellow, J.T. Hsu, pointed out that Apple began verifying TSMC's 20nm process in August this year and may begin risk production in November with the process. Volume production is expected to start in the fourth quarter of 2013, raising the possibility that TSMC will hike capital expenditure to US$11-12 billion in 2013 and 2014.

Hsu estimated Apple to design quad-core processors into iPad, iTV and even Macbook.

Apple began developing quad-core processors in 2010, when it acquired fabless chip company Intrincity. Until the acquisition, Intrincity had announced multi-core processors.

Apple's contracts have been widely criticized for low margin to contract suppliers. However, Hsu ascribed Samsung's higher cost in the production of Apple processors mostly to the company's inefficiency.


Previous
Next
New Microsoft Office Reaches RTM        All News        Law Firm Investigates OCZ For Possible Violations
New Microsoft Office Reaches RTM     General Computing News      Law Firm Investigates OCZ For Possible Violations

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Foundry in Advanced Discussions With New Customers for 7nm Chips
Apple Praises TSMC's Investments, Says iPhones Will be AI an Platform
TSMC Raises Forecasts for 2017 Due to 10nm Demand, Outlines 7 and 5nm Roadmap
TSMC Chairman Dr. Morris Chang to Retire
TSMC to Build 3nm Fab in Taiwan
Globalfoundries Asks EU to Probe TSMC
TSMC Updates its Roadmap, Talks About First 7nm Chips and EUV Migration
TSMC InFO packaging Enters Second Generation
TSMC Q2 Sales Slowed as Industry Expects the iPhone Launch
Samsung and TSMC Are Playing Catch-up to Make the Smallest Chip
Samsung Foundry Focuses on 6nm Process to Beat TSMC
Qualcomm Turns to TSMC Over Samsung For 7nm Chips

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .