Friday, April 18, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon Announces Kindle Service For Samsung Devices
Nokia Halts Sales Of Lumia 2520 Tablet
TSMC Reports Quarterly Profit
Toshiba Debuts World's Fastest microSD Memory Cards
PlayStation 4 Sales Surpass 7.0 Million Units
Google Reports Lower Than Expected First Quarter revenue
AMD Demonstrates Next-Gen x86 APU Running Fedora Linux
Lenovo Introduces A to Z and FLEX 2 series Of Laptops and Desktops
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > General Computing > TSMC Ta...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, October 12, 2012
TSMC Tapes Out First CoWoS Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface


TSMC today announced that it has taped out the first CoWoS (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface.

This new generation of TSMC's CoWoS test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component. Along with Wide I/O mobile DRAM, the integrated chips provide optimized system performance and a smaller form factor with improved die-to-die connectivity bandwidth.

CoWoS is an integrated process technology that attaches device silicon chips to a wafer through chip on wafer (CoW) bonding process. The CoW chip is attached to the substrate (CoW-On-Substrate) to form the final component. TSMC CoWoS technology has entered the pilot production stage.

TSMC worked with SK Hynix, Cadence Design Systems and Mentor Graphics to deliver the tape-out.

"Silicon validation is a critical step in the development of a highly advanced and complete CoWoS design solution," said Cliff Hou , Vice President of Research and Development at TSMC. "The successful demonstration of the JEDEC Wide I/O mobile DRAM interface highlights the significant progress TSMC and its ecosystem partners have made to capitalize on the performance, energy efficiency and form factor advantages of CoWoS technology."

In seperate news, TSMC is currently seen to be the sole 20nm process supplier to Apple quad-core processors.

Citigroup Global Markets' market research fellow, J.T. Hsu, pointed out that Apple began verifying TSMC's 20nm process in August this year and may begin risk production in November with the process. Volume production is expected to start in the fourth quarter of 2013, raising the possibility that TSMC will hike capital expenditure to US$11-12 billion in 2013 and 2014.

Hsu estimated Apple to design quad-core processors into iPad, iTV and even Macbook.

Apple began developing quad-core processors in 2010, when it acquired fabless chip company Intrincity. Until the acquisition, Intrincity had announced multi-core processors.

Apple's contracts have been widely criticized for low margin to contract suppliers. However, Hsu ascribed Samsung's higher cost in the production of Apple processors mostly to the company's inefficiency.


Previous
Next
New Microsoft Office Reaches RTM        All News        Law Firm Investigates OCZ For Possible Violations
New Microsoft Office Reaches RTM     General Computing News      Law Firm Investigates OCZ For Possible Violations

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Reports Quarterly Profit
TSMC Enjoys Q4 Profit, Getting Ready For More Efficient Chips
Samsung, TSMC, and Micron Top List of IC Capacity Leaders
Apple Works with TSMC for Manufacturing of A8 Chip: report
TSMC Introduces Its 16nm FinFET Technology
Chipmaker TSMC Reports Increased Earnings
Foundries Spending Big on Capital Equipment
TSMC Outlines Path To 16nm While Costs And Complexity Rise
TSMC To Make Apple's A8 Chip: rumors
TSMC and OIP Partners Deliver 16FinFET and 3D IC Reference Flows
Apple's Shift in Chip Manufacturing Strategy Boosts Semiconductor Foundry Business
Big Changes Reported To 1H13 Top 20 Semiconductor Supplier Ranking

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .