Friday, July 20, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google, Facebook, Microsoft, and Twitter Partner on New Data Project
Foxconn Breaks Ground in In Wisconsin Plant, Looks at AI and Beyond Apple
Western Digital and Toshiba Begin Sampling 96-layer QLC NAND
Cloud Services Keep Boosting Microsoft's Revenue
Comcast Won't Pursuit Fox assets, Focuses on Sky Offer
EU to Probe Qualcomm Over Pricing Case
Google's Project Fuchsia Could Be The Successor of Android Successor to Android
TSMC Cuts Sales, Spending Outlook
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > ARM, HP...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, June 27, 2012
ARM, HP and SK hynix To Participate On The Development Of Memory Cube


ARM, HP, and SK hynix, Inc. have joined the global effort to accelerate widespread industry adoption of Hybrid Memory Cube (HMC) technology.

The companies have joined the Hybrid Memory Cube Consortium (HMCC). Led by Micron and Samsung, the HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for the new memory technology.

Micron and Samsung are working closely with Altera, IBM, Microsoft, Open-Silicon, Xilinx and now ARM, HP and SK hynix ? to draft an industry-wide specification that should pave the way for a wide range of electronic advances.

"The strong collection of companies who have joined the consortium ? representing a broad range of technology interests ? reflects the perceived high value of HMC as the next standard for high-performance memory applications," said Robert Feurle, Micron's vice president for DRAM marketing. "With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next-gen electronics."

HMC features will enable highly efficient memory solutions for applications ranging from industrial products to high-performance computing and large-scale networking. The HMCC's team of developers plans to deliver a draft interface specification to the growing number of "adopters" joining the consortium. Then, the combined team of developers and adopters will refine the draft and release a final interface specification, currently targeted for the end of this year.

As envisioned, HMC capabilities will leap beyond current and near-term memory architectures in the areas of performance, packaging and power efficiencies, offering a major alternative to present memory technology.

One of the primary challenges facing the industry -- and a key motivation for forming the HMCC -- is that the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide. The term "memory wall" has been used to describe this challenge. Breaking through the memory wall requires architecture such as HMC that can provide increased density and bandwidth with significantly lower power consumption.


Previous
Next
VESA Brings DisplayPort To Mobiles, Battles With MHL        All News        EU court Rejects Microsofty's Antitrust Appeal, Cuts Fine
New Core i3 Ivy Bridge Mobile Processors Released     PC Parts News      Judge Blocks U.S. Sales of Samsung Galaxy Tab 10.1

Get RSS feed Easy Print E-Mail this Message

Related News
Micron and Intel to End Their 3D XPoint Joint Development Partnership
Micron Says UMC Patent Ruling Will Have Minimal Impact to Revenue
Micron Chip Sales Banned in China, UMC Says
Micron GDDR6 Memory Enters Volume Production
Micron Had a Record Quarter in Terms of Revenue and Profitability
Micron and Intel Deliver First 1Tb - 4bits/cell QLC 3D NAND Die
Cadence and Micron Prototype First DDR5 Memory
Micron Launches 5200 SATA Enterprise SSD Featuring 64-layer 3D NAND
UMC Countersuits Micron
Micron and Intel to Limit Their NAND Memory Joint Development Program
Crucial MX500 1TB SSD Retails for $259
Samsung, SK Hynix and Micron Lead the Server DRAM Market

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .