Tuesday, January 17, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Airbus Could Build A 'Flying Car' This Year
Intel Unveils New Intel Responsive Retail Platform, Announces $100 Million Investment Plan
Raspberry Compute Module 3 Launched
SpaceX Sends Satellites into Orbit
LG Touts Safety Features OF G6 Smartphone
Nintendo Switch Coming In March For $299
YouTube Super Chat Lets You Pay to Pin comments On Live Streams
Samsung Adds New Capabilities And Categories To Their Mobile Alliance Program
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Micron ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, October 07, 2011
Micron and Samsung Launch Consortium to Accelerate Hybrid Memory Cube Interface Adoption


Samsung and Micron today announced the creation of a consortium for OEMs, enablers and integrators that will collaborate in developing and implementing an open interface specification for a new memory technology called the Hybrid Memory Cube (HMC).

Micron and Samsung are the founding members of the Hybrid Memory Cube Consortium (HMCC), and will work closely with developers Altera Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate industry efforts in bringing to market a broad set of technologies. The consortium will initially define a specification to enable applications ranging from large-scale networking to industrial products and high-performance computing.

One of the primary challenges facing the industry - and a key motivation for forming the HMCC - is that the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide. The term "memory wall" has been used to describe the problem. Breaking through the memory wall requires a new architecture that can provide increased density and bandwidth at significantly reduced power consumption.

Hybrid Memory Cube is a new DRAM memory architecture that combines high-speed logic process technology with a stack of through-silicon-via (TSV) bonded memory die. According to the consortium, it offers dramatic improvements in performance, breaking through the memory wall and enabling performance and bandwidth improvements - a single HMC can provide more than 15x the performance of a DDR3 module. The architecture of HMC is exponentially more efficient than current memory, utilizing 70% less energy per bit than DDR3 DRAM technologies. Hybrid Memory Cube's increased density per bit and reduced form factor contribute to lower total cost of ownership, by allowing more memory into each machine and using nearly 90% less space than today's RDIMMs.

"This collaborative industry effort will serve as an accelerator for highly promising technology that will benefit the entire industry," said Jim Elliott, Vice President, Memory Marketing and Product Planning, Samsung Semiconductor, Inc. "The consortium will help to bring about a game-changing system solution for system designers and manufacturers that is expected to outperform memory options offered today."

"HMC is unlike anything currently on the radar," said Robert Feurle, Micron's Vice President for DRAM Marketing. "HMC brings a new level of capability to memory that provides exponential performance and efficiency gains that will redefine the future of memory. Guidance by the industry consortium will help drive the fastest possible adoption of the technology, resulting in what we believe will be radical improvements to computing systems."

The HMCC's memory specifications will be co-developed among the consortium members. The consortium is open to an unlimited number of adopters, with the opportunity to receive early access to draft specifications and participate in specification discussions and development.


Previous
Next
AMD Demonstrates 28nm Graphics Processor at Fusion 2011        All News        Intel Brings CinemaNow HD Movie Content To PCs
Sony Updates Their VAIO Line For The Holidays     PC Parts News      Intel Brings CinemaNow HD Movie Content To PCs

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Adds New Capabilities And Categories To Their Mobile Alliance Program
LG Display To Supply LCD Panels For TVs to Rival Samsung Electronics
Samsung Vice Chairman Suspect in Political Probe
Samsung SDI Presents Fast Charging Battery That Enables Electric Vehicles to Drive 600km
Samsung's Latest Wearables Get iOS Compatibility
Samsung's Exynos Processors To Power Future Audi Cars
Samsung NEXT at CES 2017
Samsung Q4 Profit Beats Estimates Despite Galaxy Note 7 Fiasco
CES: Samsung Introduces Odyssey Gaming Notebook, New Chromebooks, Updates the Notebook 9
Samsung Unveils Its New QLED TVs, LG Responds With New Signature OLED TV W Series
Samsung Unveils Family Hub 2.0 and Smart Built-in Appliances at CES 2017
Galaxy S8 Said To Offer A Desktop Experience

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .