Friday, January 19, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Italy Probes Apple and Samsung Over Smartphone Software Updates
SoftBank Becomes Uber's Largest Shareholder
Congress Votes to Extend NSA Spying
IBM Reports Revenue After Six Years
Western Digital Expands Mid-Range Enterprise Air-based Hard Drives Offerings
Amazon Eyes the Advertising Business: report
European Regulators Approves Qualcomm's Acquisition of NXP, Subject to Conditions
Intel Says That Patches for Spectre, Meltdown Affect Newer Chips
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, December 28, 2017
Samsung to Develop Its Own Fo-WLP Chip Packaging Process


Samsung Electronics will reportedy develop its own semiconductor packaging process in 2018, as the company is trying to win back foundry orders for Apple's application processors (AP) that were taken by TSMC in 2016.

South Korean ETNews reports that Samsung Electronics Semiconductor Business Department is making investments in order to develop the new Fanout-Wafer Level Package (Fo-WLP) process. Samsung Electronics' goal is to establish a mass-production system for the new process by 2019.

In short, packaging protects the chip (die) when it is cut from a silicon wafer. The process protects the chip from moisture, impurities, and impact and delivers signals to the main PCB. A goal is to make the chip's area small in order to be able to add more I/O (Input/Output) terminals.

Fan-out technology pulls the wiring outside the chip, allowing for thinner ovearall packaging and lower production costs. Specificaly, the FoWLP technology is an enhancement of standard wafer-level packages (WLPs) developed to provide a solution for semiconductor devices requiring a higher integration level and a greater number of external contacts. It provides a smaller package footprint with higher input/output (I/O) along with improved thermal and electrical performance.

In conventional WLP schemes I/O terminals are located over the chip surface area. Using this method, there is a limitation to the number of I/O connections.

FOWLP takes individual die and embeds them in a low cost material such as epoxy mold compound (EMC) with space allocated between each die for additional I/O connection points - avoiding the use of relatively expensive Si real estate to accommodate a high I/O count. Redistribution Layers (RDL) are formed using PVD seed deposition and subsequent electroplating/patterning to re-route I/O connections on the die to the mold compound regions in the periphery.

TSMC was the first in the world to commercialize the Fo-WLP technology for APs and it was able to win orders for the 16nm A10s chips for the iPhone 7 and the 10nm A11s for the iPhone 8. TSMC calls its packaging process Fo-WLP.



Previous
Next
SoftBank Consortium Buys Stake in Uber        All News        LG Showcases 2018 Audio Lineup With Meridian
SoftBank Consortium Buys Stake in Uber     General Computing News      LG And HERE Technologies Partner On Autonomous Cars

Get RSS feed Easy Print E-Mail this Message

Related News
Italy Probes Apple and Samsung Over Smartphone Software Updates
Samsung Starts Producing First 16-Gigabit GDDR6
Samsung to Offer Athletes PyeongChang 2018 Olympic Games Limited Edition Smartphone
Samsung Thrive App Will Notify Your Friends When You Are Offline
Samsung SDI Unveils New Battery Products at Detroit Motor Show
Samsung Posts Lower-than-expected Fourth Quarter Results
Samsung Mobile Chief Cautious About a Foldable Phone Launch in 2018
HARMAN and Samsung Unveil Connectivity and Autonomous Driving Technology at CES 2018
Samsung Unveils "The Wall," a Modular MicroLED 146-inch TV
Samsung Introduces the New Notebook 7 Spin, Notebook 9 (2018) and Notebook 9 Pen
Samsung Takes Over No. 1 Position in Global Semiconductor Market
TSMC Could Outpace Samsung in 7nm Volume Production This Year

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .