Monday, February 26, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
MWC: HUAWEI MateBook X Pro, HUAWEI MediaPad M5 Series and the First 3GPP 5G CPE
Intel to Bring 5G Technology at the 2020 Tokyo Olympics
ZTE Launches the $80 Tempo Go Android Oreo Device
‌MWC: New Nokia Phones Including Nokia 8 Sirocco Released
Nokia CEO Announces 5G Rollouts
Samsung Galaxy S9 is Official With Dual Cameras, Super Slow-mo and AR Emoji
LG V30S ThinQ Smartphone With Integrated AI Debuts at MWC 2018
MWC: The Cat S61 Smartphone Measures Distances, Senses the Quality of Air
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > SK Hyni...
Last 7 Days News : SU MO TU WE TH FR SA All News

Saturday, April 25, 2015
SK Hynix To Start Production Of 36-Layer 3D NAND Flash Chips


SK Hynix is joining the small list of companies that mass producing 3D NAD flash chips, with mass production scheduled to start later this year.

The South Korea company plans to initially mass produce 36-layer 3D NAND flash chips amd contimue with 48-layer products from next year. NAND-based flash memory retains data without power, and 3D NAND flash memory stacks memory cells vertically to maximize storage capacity in a small area.

"We have developed 24-layer 3D NAND flash chips and completed the preparation for mass production at the end of last year. The first to be mass produced will be the 36-layer products. Also, we will start preparing the mass production of the 48-layer 3D NAND flash memory chips from the end of this year so we can have cost competitiveness next year," SK Hynix said during the conference call after its Q1 earnings release earlier this week.

Rival Samsung Electronics is expected to produce 48-layer 3D NAND flash chips later this year, while Intel and Micron are also jumping into the race.

In addition to 3D NAND flash chips, the SK Hynix will release 16 nm TLC-based NAND flash chips and increase its share to the latter half of 10 percent in Q2 and 40 percent by the end of the year. Also, it will launch TLC-based Solid State Drive (SSD) chips and expand its share to 20 to 30 percent in Q3.

SK Hynix will also unveil a late-10 nm DRAM sample product in June next year. Currently, Samsung Electronics is about to mass produce late-10 nano DRAM products.



Previous
Next
China Telecom To Sell Phones With Alibaba        All News        Apple Watch Available In Select Stores
GeIL's Latest DDR4 SUPER LUCE Memory 'Breathes'     PC Parts News      Acer Reveals New Product Range at Event in New York

Get RSS feed Easy Print E-Mail this Message

Related News
SK Hynix Starts Sampling Enterprise SSDs with its 72-Layer 512Gb 3D NAND Flash
Tsinghua Unigroup May License 3D NAND flash Technology From Intel
Toshiba to Prepare New Semiconductor Fabrication Facility
Toshiba Unveils UFS Devices Based on 64-Layer, 3D Flash Memory
Toshiba Develops First 3D Flash Memory with TSV Technology
Toshiba Announces 96-Layer 3D Flash Memory and 64-Layer QLC 3D Flash Memory
3D-NAND to Become Mainstream This Year
SK Hynix Introduces First 72-Layer 3D NAND Flash
SK Hynix Offers More Than $9 billion for Toshiba Chip Unit: report
Western Digital Releases New iNAND 7350 Storage Solution Built on 3D NAND
Toshiba Starts Sampling 64-Layer, 512-gigabit 3D Flash Memory
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .