Friday, June 22, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Chatting With Google Assistant Gets More Natural
Intel CEO Brian Krzanich Resigns After Found to Have Relationship With Employee
Xbox Won't Support VR
AT&T to Launch Wireless Plans Bundled With Video
NVIDIA CEO Springs Special Titan V GPUs on Elite AI Researchers
Samsung Details its 7nm EUV Technology
HDR10+ Technologies Unveil Licensing and Logo Certification Program
Samsung SDI Unveils New Residential ESS Module
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, February 04, 2015
Samsung Starts Mass Production Of ePoP Memory for Smartphones


Samsung Electronics said Wednesday it has started mass production of a one-package chip, which stacks a number of different smartphone parts together, enabling thinner handsets with bigger batteries.

The company is now mass producing the first ePoP (embedded package on package) memory – a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card) and a controller. For use in high-end smartphones, the thin ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile processor, without taking any additional space - an improvement over existing two-package eMCP memory solutions. The 3GB LPDDR3 mobile DRAM inside the ePoP operates at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth.

Because of its thinness and special heat-resistant properties, Samsung’s smartphone ePoP does not need any space beyond the 225 square millimeters (15x15mm) taken up by the mobile application processor. A conventional PoP (also 15mm x 15mm), consisting of the mobile processor and DRAM, along with a separate eMMC (11.5mm x 13mm) package, takes up 374.5 square millimeters. Replacing that set-up with a Samsung ePoP decreases the total area used by approximately 40 percent. The single-package configuration also meets the semiconductor package height ceiling of 1.4 millimeters (mm).

Samsung already has been offering a similar single-package solution for wearable devices, referred to as "wearable memory".



Previous
Next
Samsung Display Granted Patent For Dual-edge Display Technology        All News        Sony Narrows Loss Forecast After Strong Sensor Sales
Samsung Display Granted Patent For Dual-edge Display Technology     Mobiles News      New ARM Cortex A-72 Platform To Power 4K Graphics On Smartphones

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Details its 7nm EUV Technology
Samsung SDI Unveils New Residential ESS Module
Samsung Introduces 8TB SSD for Data Centers in NF1 Form Factor
Samsung, SK Hynix Experience Low Yields in 18nm DRAM Production
Samsung Starts Researching EUV For DRAM: report
Samsung Lost FinFET Patent Case, Ordered to Pay $400 Million
New Samsung Chromebook Plus V2 Gets New Processors and Cameras
Samsung Launches Fund to Invest in AI Startups
Analysts Talks About Samsung's Upcoming Foldable Galaxy Smartphone
Samsung Begins Production of 16Gb, 64GB DDR4 RDIMM For Servers
Samsung and LG Eye Expansions into the Car Display Market
New Galaxy J3 and J7 Provide Features at an Affordable Price

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .