Thursday, February 22, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
SK Telecom to Unveil 'HoloBox' Hologram AI Technology at Mobile World Congress 2018
Worldwide Sales of Smartphones Declined in 4Q, Samsung Retains First Spot
Intel Brings 5G Connectivity to PCs
Samsung and Qualcomm Expand Foundry Cooperation on EUV Process Technology
LG To Unveil Updated K8 AND K10 Smartphones at MWC
Qualcomm Introduces First Integrated 802.11ax-ready Solution for Smartphones
Google Brings Digital Assistant to Nest Camera
ARM Wants to Integrate a SIM Card into SoCs for IoT
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Intel a...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, January 26, 2011
Intel and IBM To Discuss Server Processors at ISSCC


At the International Solid State Circuit Conference (ISSCC), which will be held in San Francisco from Feb. 20-24, Intel will discuss its next-generation Itanium chip code-named Poulson and IBM will present its its zEnterprise 196 quad-core server chip.

IBM's Enterprise 196 quad-core server chip is clocked at 5.2GHz and it already powering IBM's zEnterprise mainframe systems. The chip uses 1.4 billion transistors and includes a high-speed 24MB shared DRAM L3 cache. IBM will describe the challenges met in order to meet this high-frequency design objective, including significant timing, power and noise problems which had to be resolved.

Intel's Itanium chips are designed for high-end servers that require high uptime and reliability. The Poulson chips, which will succeed the existing Itanium processors code-named Tukwila, implemented in 32nm CMOS with 9 layers of Cu contains a record 3.1 billion transistors, an improvement from the 65nm process used to make Tukwila chips. The die measures 18.2?29.9mm2. The processor has 8 multi-threaded cores, a ring-based system interface and combined cache on the die is 50MB. High speed links allow for peak processor-toprocessor bandwidth of up to 128GB/s and memory bandwidth of up to 45GB/s, according to Intel.

Intel will also duscuss a 32nm westmere-eX Xeon enterprise processor, a monolithic 10-core Xeon Processor designed in a 32nm 9M process with a shared L3 cache. Intel has introduced low power modes to cut idle power compared to the previous generation processor. A 2nd order CTLE and temperature compensation are implemented in the I/O receiver to enable link survivability even with low RX margins. Core- and cache-recovery techniques have also maximize yield, according to Intel.

Staying with Intel, the company will also described the recently released 32nm Sandy Bridge processor that integrates up to 4 Intel Architecture (IA) cores, a power/performance optimized graphic processing unit (GPU) and memory and PCIe controllers in the same die. Intel will talk about some of the integration methods, power saving techniques and the clock distribution network.

AMD will also have a presence at the conference. The company will design Solutions for the Bulldozer 32nm Soi 2-core processor, which contains 213M transistors in an 11-metal layer 32nm high-k metalgate SOI CMOS process and is designed to operate from 0.8 to 1.3V. AMD claims that this micro-architecture improves performance and frequency while reducing area and power over a previous AMD x86-64 CPU in the same process. The design reduces the number of gates/cycle relative to prior designs, achieving 3.5GHz+ operation in an area (including 2MB L2 cache) of 30.9mm2.

Staying with AMD, the company will talk about its low-power Zacate SoC based on its Fusion technology. Zacate combines x86 CPU and Radeon GPU on a single 40nm bulk CMOS die. The SoC uses an internal bus architecture and design techniques to optimize performance and memory bandwidth without compromising on power savings. Fine-grain power gating, dynamic voltage/frequency scaling and enhanced display refresh are key enablers for low-power operation.

Another player aiming to gain a foothold in the high-end chip market is the Chinese government's Chinese Academy of Sciences, which will be presenting its next-generation Godson processor. The Godson-3B processor is an 8-core high-performance processor implemented in a 65nm CMOS LP/GP mixed process with 7 layers of Cu metallization. It contains 582.6M transistors in a 299.8mm2 area. The highest frequency of Godson-3B is 1.05GHz. Its peak performance is 128/256GFLOPS for double/single-precision with 40W power consumption.


Previous
Next
Globalfoundries Initiates 28nm Production, Plans to Migrate to 20nm in 2012        All News        Intel To Natively Support USB 3.0 With Panther Point Chipset
Globalfoundries Initiates 28nm Production, Plans to Migrate to 20nm in 2012     PC Parts News      Intel To Natively Support USB 3.0 With Panther Point Chipset

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Brings 5G Connectivity to PCs
AMD Brings x86 'Zen' Architecture to the Embedded Market With new Ryzen Processors
Intel Releases Updated Firmware for 6th, 7th and 8th Generation Intel Core Processors, Intel Xeon Scalable Processors
Investors and Consumers Sued Intel Over Meltdown and Spectre CPU Security Flaws
Intel SSD DC P4510 and P4511 Series Come in New Form Factors, 64-layer TLC 3D NAND
Intel Focuses on Silicon Spin Qubits for Quantum Computing
Intel Graphics Drivers Add Game Optimization Feature
Intel Raises Bug Bounty Awards, Expands Program
ISSCC: Samsung Working on 7-nm EUV SRAM, Intel Details 10-nm SRAM
New 8th Gen Intel Core i3 Processor Expands Performance Options for Thin and Light Laptops
First AMD Ryzen Desktop APUs Featuring Powerful Graphics Released
Intel Releases Spectre Microcode Update for Skylake Chips

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .