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Tuesday, December 15, 2009
Toshiba Launches Highest Density Embedded NAND Flash Memory Modules


Toshiba today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry.

The chip is the flagship device in a new line-up of six embedded NAND flash memory modules that offer full compliance with the latest e MMCTM standard, and that are designed for application in a wide range of digital consumer products, including smartphones, mobile phones, netbooks and digital video cameras. Samples of the 64GB module are available from today, and mass production will start in the first quarter of 2010.

The new 64GB embedded device combines sixteen 32Gbit (equal to 4GB) NAND chips fabricated with Toshiba's 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining sixteen 32Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.

Toshiba offers a line-up of single-package embedded NAND Flash memories in densities ranging from 2GB to 64GB. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest e?MMCTM standard and its new features, including defining multiple storage areas and security features.



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