Wednesday, September 28, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Blackberry Offifially Stops Making Smartphones, Outsources Mobile Business To Indonesian BB Merah Putih
SpaceX Chief Envisions Ships Flying to City On Mars
New Macbook Air, Macbook Pro 2016 Comig Next Month
Samsung Pay Adds Support for Coupons and Restore Function
USB-IF Announces USB Audio Over USB Type-C Specifications
Roxio Creator NXT 5 Supports Disc Burning With Multi-Camera Video Editing
ARM Unveiled New On-chip Interconnect Technology
AMD Brings The Power Of Polaris To Embedded With New Radeon E9260 and E9550 GPUs
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC Cl...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, November 26, 2009
TSMC Closes 32nm Project to Focus on 28nm


Taiwan Semiconductor Manufacturing Co. (TSMC) has decided to stop its 32-nanometer process addressing all resources on the development of the 28nm process, according to reports.

The world's largest silicon foundry had initially planned to begin to offer 32nm process by the end of this year, with industry watchers believing TSMC closed the 32nm project due to yield issues with its 40nm process, the Taiwan Economic News reported today.

However, industry executives believe that TSMC is keen to offer 28nm process to keep up with circuit geometry advances of microprocessors, graphic processing units and field programmable gate arrays (FPGAs) and has worked with several chip design houses in these sectors.

Investors presume these design houses are customers of TSMC`s 40nm process service migrating to 28nm layouts.

Also, some industry executives believe that TSMC will use 28nm process on the system-on-chip for Intel`s Atom processors.

TSMC's 28nm development and ramp seems to has remained on schedule since the company announced the technology in September 2008. Last August, TSMC added a low power process to its 28nm high-k metal gate (HKMG) road map, scheduled to enter risk production in the third quarter of 2010. Risk production for the 28nm low power (LP) SiON process was scheduled for the end of first quarter of 2010, while risk production for the 28nm HP process was expected at the end of second quarter, 2010.

TSMC has announced the development of the 28nmHPL (low power with HKMG) process, which is a derivative of TSMC's high performance HKMG technology and features low power, low leakage, and medium-high performance on a gate-last approach. It supports low leakage applications such as cell phone, smart netbook, wireless communication and portable consumer electronics.

The 28nm HPL process comes complete with comprehensive device support and is considered suitable as a SoC platform for general market applications. It is differentiated from the 28LP technology, which is positioned for cellular and handheld applications where lower cost and faster time-to-market from a SiON process is most attractive.

The 28nm HP process is also built on a gate-last approach and supports performance driven devices such as CPUs, GPUs, Chipsets, FPGAs, video game console and mobile computing applications.

TSMC is also expected to collaborate with Fujitsu Microelectronics Ltd. on the 28-nanometer (nm) process technology. The Japanese company has already collaborated with TSMC on the 40nm production.


Previous
Next
Buffalo Adds USB 3.0 Interface To New 12x Blu-ray Burner        All News        Thunderbird 3.0 RC Available For Download
Europe Charges Companies With Forming TV and Computer Monitor Tubes Cartels     General Computing News      Thunderbird 3.0 RC Available For Download

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC To Use Different Processes And 3D Packages Across Future Design Platforms
TSMC 7nm Volume Production To Start In 1Q18
TSMC Foundry Market Share Drops in 2016
Samsung, TSMC And Intel Set To Expand Their Chip Production Capacities In 2H
TSMC To Follow The Extreme Ultraviolet Approach For 5nm
TSMC 2Q16 Profits Fall, Revenue Grew
TSMC to Boost R&D Spending To Accelerate Development Of More Advanced Chips
ARM And TSMC Validate First Multicore Test Chip Based on 10FinFET Technology
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
TSMC To Build 12-inch Fab In China
ARM and TSMC To Collaborate on 7nm FinFET Process Technology

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .