Wednesday, June 28, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Toshiba Delays Chip Unit Deal, Sues Western Digital
Qualcomm Debuts the Snapdragon Wear 1200 and the Snapdragon 450 Mobile Platforms
Samsung Launches ISOCELL Image Sensor Brand
Toshiba Announces 96-Layer 3D Flash Memory and 64-Layer QLC 3D Flash Memory
Western Digital Announces First 96-Layer 3D NAND Technology
New Intel SSD 545s Packs 64-layer 3D TLC Flash
Ransomware Hits Servers Across the Globe
New Sony 20MP CMOS Image Sensor Released
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 22, 2009
Toshiba Adds 32nm mSATA and Half-Slim Solid State Drive Modules


Toshiba today announced a series of solid state drive (SSD) modules using the latest generation Toshiba 32nm MLC NAND flash, at Intel Developers Forum 2009.

The Toshiba SG2 modules are offered in two types, one based on the new low-profile mini-SATA (mSATA) interface standard and the other a Half-Slim type, which uses a SATA connector. The drives are available in 30GB(1) and 62GB modules. Volume production will start in October.

The two types of modules, each smaller than a business card, provide greater design flexibility and save space and cost compared to SSDs with hard disk drive form factors and cases. The 62GB module is only one seventh the volume and one eighth the weight of a 2.5-inch form factor SSD, and consumes half the power. With interface speeds up to 3 gigabits per second (Gb/s)(2), a maximum sequential read speed of 180 megabytes per second (MBps) and a maximum sequential write speed of 70MBps, the modules will help bring the performance advantages of SSDs to notebooks, portable electronics and embedded systems. An advanced controller features a translation mode, which enables any drive configuration, and the drive supports 28-bit LBA (Logical Block Address) mode commands and 48-bit LBA mode commands. Multi-word DMA, Ultra-DMA modes and Advanced PIO commands are supported. The drives have an optional capability for secure Full Disk Encryption (FDE) backup that prevents unauthorized data access.



"Initial adoption of most SATA solid state drives has followed the HDD form factor. Our latest 32nm mSATA and Half-Slim case-less modules enable hardware designers to add the performance and reliability advantages of a solid state drive in a smaller, footprint for notebooks, portable electronics and other embedded storage applications," said Scott Nelson, VP Memory, TAEC.

The mSATA modules leverage the speed and reliability of the popular SATA interface, in a small form factor module, 1.18 in. x 0.19 in. x 2 in. (30mm x 4.75mm x 50.95mm) that connects to the system board using the low profile SATA connector. Adaptive Power Mode and SATA Device Initiated Power Management typically reduce power consumption to less than half of the Read power level when the device is in idle, standby or sleep mode.

The Half-Slim SATA II modules feature a SATA connector, measure 1.18 in. x 0.19 in. x 2 in. (54mm x 4 mm x 39mm). The Half-Slim SATA II modules have the same SATA connector used on 2.5-inch HDD and SDD form factors. Thus, this smaller form factor can easily be used in applications designed to use 2.5-inch storage form factors. The Half Slim is also JEDEC compliant.



Previous
Next
Samsung Announces Production Start-up of Its Nonvolatile Memory - PRAM        All News        Design Expo Held at IDF Highlights Future Computing Possibilities
SATA-IO to Develop Specification for Mini Interface Connector     PC Parts News      Design Expo Held at IDF Highlights Future Computing Possibilities

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Delays Chip Unit Deal, Sues Western Digital
New Intel SSD 545s Packs 64-layer 3D TLC Flash
Western Digital Resubmits Bid for Toshiba Chip Unit
Toshiba Chip-Unit Final Agreement Said to be Delayed, WD Opposes Participation of SK Hynix
Toshiba Open to Further Talks With Western Digital About Chip Unit Sale
Japan-led Consortium Wins Toshiba Memory Bidding
Toshiba Applies Spintronics Technology to Strain-gauge Sensor Element to Boost Sensitivity
Western Digital's SanDisk Subsidiaries Seek Injunctive Relief Against Toshiba in the Superior Court of California
Toshiba Faces New Lawsuit Over Accounting Scandal
Toshiba Announces Next Generation 15,000rpm AL14SX HDD
Apple, Dell, Kingston, Amazon, Could Join Foxconn In Bid for Toshiba Chip Business
Western Digital Said to Sweeten Offer For Toshiba's Memory Unit

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .