Friday, October 31, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Updated BBM Offers More Privacy, Control and More
Panasonic Raises Profit Outlook
Toshiba Offers New 4TB and 5TB Desktop HDDs
Samsung Introduces New Ultra Slim Galaxy A5 and Galaxy A3 Smartphones For The Chinese Market
Sharp 2Q Profit Slides
PlayStation 4 Sales Sustain Sony's Quarterly Loss
MSI Debuts The GT80 Titan Gaming Notebook With Mechanical Keyboard
Sharp To Produce New Backlight-free LCD Panel For Wearables
Active Discussions
DVD/DL for Optiarc 7191S at 8X
Copied dvd's say blank in computer only
Made video, won't play back easily
New Features In Firefox 33
updated tests for dvd and cd burners
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
 Home > News > PC Parts > Intel's...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, August 21, 2009
Intel's 22nm Process to Enter Volume Manufacturing Stage in 2012


Intel is optimistic that it will be able to mass produce chips using the 22nm process in two yeas from now, the company said in a press event in Japan on Thursday.

The company's technology outlook includes the transition to the 32nm manufacturing process later this year, with full scale production to be applied in 2010, the Japanese technology web site PC Watch reported on Thursday.

Intel uses a logic technology that incorporates second-generation high-k + metal gate technology, 193nm immersion lithography for critical patterning layers and enhanced transistor strain techniques. These features enhance the performance and energy efficiency of Intel processors. Intel's manufacturing process has the highest transistor performance and the highest transistor density of any reported 32nm technology in the industry, the company claims.

Intel also believes that the use of Hafnium-based high-k metal gate (Hi-k) formula and the use of Metal (gate electrode) - both already used in the 45nm process - will again be the key to the succesful transition to the advanced 22nm process in 2010.

Beyond that, Intel's roadmap includes the transition to the 22nm technology node in 2012, followed by the 16nm in 2014 and the 11nm process two years later.



Finishing the development phase for the company's 32nm process technology and production readiness in this timeframe means that Intel remains on pace with its ambitious product and manufacturing cadence referred to as the company's "tick-tock" strategy. That plan revolves around introducing an entirely new processor microarchitecture alternating with a cutting edge manufacturing process about every 12 months.





Westmere architecture on the scene

In related news, Intel is expected to focus on its next generation of smaller and faster chips based on the Westmere architecture at the Intel Developer Forum (IDF), which will be held Sept. 22-24 in San Francisco.

Nehalem played a big role during IDF 2008. Many new details were introduced during keynotes and in briefings, including features built into the microarchitecture like Turbo Mode, which allow the cores to dynamically scale up to handle demanding needs like video encoding or scale down to use just enough of a core to finish a simple task like typing.

Where Nehalem was new chip archeticture design, Westmere is the next design being used to build processors that feature two 32nm cores with 4MB of cache that sit next to a memory controller and integrated graphics built on a separate, neighboring 45nm chip, all in one package. Westmeres will be the basis of upcoming all new Core chips (Core i3, i5, and 7) over the next few months.

Westmere processors will share some of the same features that were built into Nehalem, including Hyper-Threading and Turbo Boost.

Some Westmeres will feature HyperThreading will allow each core to handle two threads - or process two jobs at once.


Previous
Next
Under the Hood Updates For The Wolfram|Alpha Computational Engine        All News        Patriot Launches Sector 5 Gaming Series in Anticipation of Intel's P55 Chipset
Nokia Enters PC Industry With The Booklet 3G     PC Parts News      Patriot Launches Sector 5 Gaming Series in Anticipation of Intel's P55 Chipset

Get RSS feed Easy Print E-Mail this Message

Related News
Intel To Work With AT&T To Research Software Defined Networking
Intel Meegopad T01 Is A Bay Trail PC On HDMI Stick
The Intel Experience Coming In Best Buy Stores
New Data Protection Tecnology Protects Point-of-sale Data
Intel Reports Record Third-Quarter Revenue
Intel Releases Internet of Things Developer Kit
Intel and Mitsubishi Electric Collaborate to Create Factory Automation Systems
Intel To Invest in Semiconductor Business under Tsinghua Unigroup
Latest Intel LTE Chipset Certified on China Mobile
Intel Offers Developers Software Tools, Outlines PC Evolution Across New Form Factors
Intel Unveils New Developer Tools, Future Technologies Tablets, Analytics, Wearable Devices and PCs at IDF 2014
New Intel Xeon E5-2600 v3 Processors Released

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .