Sunday, May 29, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Nvidia's GeForce GTX 1080 Launches Wordlwide
Corsair Bulldog PC Is Seeking A Place In Your Living Room
Samsung Galaxy C5 and C7 Released In China
SSD Adoption in Notebooks To Increase This Year As TLC NAND Market Matures
Samsung To Launch SamsungPay Mini Online Payments App
Facebook Publishers To Show Ads To Everyone
Samsung and Warner Bros. Release The Samsung Galaxy S7 edge Injustice Edition
Acer At Computex 2016
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > GLOBALF...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, June 17, 2009
GLOBALFOUNDRIES Details Advanced Technology Aimed at 22nm and Beyond


GLOBALFOUNDRIES today described an innovative technology that could overcome one of the key hurdles to advancing high-k metal gate (HKMG) transistors, bringing the industry one step closer to the next generation of mobile devices with more computing power and improved battery life.

The semiconductor industry is celebrated for overcoming seemingly insurmountable odds to continue the trend toward smaller, faster, and more energy-efficient products. Performed in partnership with IBM through GLOBALFOUNDRIES? participation in the IBM Technology Alliance, the new research is designed to enable the continued scaling of semiconductor components to the 22 nanometer node and beyond.

At the 2009 Symposium on VLSI Technology in Kyoto, Japan, GLOBALFOUNDRIES reported the first demonstration of a technique that allows the equivalent oxide thickness (EOT) in a high-k metal gate (HKMG) transistor to scale down to well beyond the level required for the 22nm node, while maintaining a combination of low leakage, low threshold voltages, and superior carrier mobility.

"HKMG is a critical component of GLOBALFOUNDRIES? technology roadmap," said Gregg Bartlett, senior vice president of technology and research and development. "This development could eventually provide customers with another tool to enhance the performance of their products, particularly in the fast-growing market for ultra-portable notebooks and smartphones with extended battery life. In conjunction with IBM and the alliance partners, we are tapping our global knowledge base to develop advanced technologies that will allow our customers to stay at the leading edge of semiconductor manufacturing."

To maintain the switching precision of a HKMG transistor, the EOT of the high-k oxide layer must be reduced. However, reducing the EOT increases the leakage current, which can contribute to an increase in the power consumption of a microchip. GLOBALFOUNDRIES and IBM have developed a new technique that overcomes this barrier, demonstrating for the first time that EOT scaling to well beyond the 22nm node can be achieved while maintaining the necessary combination of leakage, threshold voltages, and carrier mobility. The results were successfully demonstrated through fabrication of an n-MOSFET device with EOT of 0.55nm and a p-MOSFET with EOT of 0.7nm.

GLOBALFOUNDRIES is a leading-edge semiconductor manufacturing company. The company weas launched in March 2009 through a partnership between AMDand the Advanced Technology Investment Company (ATIC).


Previous
Next
Panasonic Develops 85-inch Full HD Plasma Display        All News        Western Digital Begins Shipping First SATA/PATA SSDS
TSMC Reports Foundry's First 28 Nanometer Low Power Platform Technology with Fully Functional 64Mb SRAM     General Computing News      Opera Unite: Free File Sharing Sevice

Get RSS feed Easy Print E-Mail this Message

Related News
AMD Introduces the FirePro S7100X Hardware-Virtualized GPU for Blade Servers
GLOBALFOUNDRIES Releases 130nm SiGe RF Technology For Wireless Network Communications
AMD Radeon R3 SSDs Released
AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture
AMD Launches Its Most Powerful Graphics Card
AMD Posts Low Quarterly Revenue
AMD FirePro W9100 Professional Graphics Card Comes With 32GB Memory
AMD Teases With Its 7th Generation Bristol Ridge Mobile APU
AMD's Processor Recommendations For VR by HTC and Valve
AMD New FirePro S9300 X2 Pro Graphics Card Is Powered By Two Fiji GPUs
AMD Touts Radeon Graphics Capabilities In The DirectX 12 Era
AMD XConnect Software Allows For Plug-and-play Connection Between Laptops And External GPUs

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .