Hynix Semiconductor announced<

This product provides twice as much storage capacity over current 1Gb mobile solution which has been the highest density offered among the mobile DRAM products in MCP (Multi Chip Package), PoP(Package on Package) platform. It boasts maximum operating speed of 400Mbps (Megabits per second) at 1.2V power supply and processes up to 1.6 Gigabytes of data per second with a 32-bit I/O. Moreover, the new product consumes less power than existing memory solutions.

Besides its various features, the new product also has function of Hynix's One Chip Solutions. It offers flexible options for both SDRAM and DDR DRAM interfaces, and both x16 and x32 organizations on a single chip.

The product which meets JEDEC standard is suited for the next generation applications of MID (Mobile Internet Device) and UMPC (Ultra Mobile PC) as well as higher density required products.

Hynix plans to start mass production in the first half of next year.