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Friday, November 14, 2008
AMD Promotes New Products, Pushes Fusion Platform to 2011

AMD has changed its original plans to introduce chips that combine CPU and and graphics cores to 2011, at a time where the when it will roll its first 32 nm products.

AMD's executives gave an update of th company's progress toward profitability, products, marketing, manufacturing and operational initiatives on Thursday at the company's 2008 Financial Analyst Day in Sunnyvale, Calif.

The company has canceled its plans to release in 2010 its first dual-core 45 nm processor that would combine graphics and x86 cores. Instead, AMD will inntroduce in 2010 a four-core notebook processor in a BGA package.

AMD's "rival" Intel is expected to release a notebook processor that includes a graphics core in the end of 2009.

AMD's first 32 nm processors will be delivered in 2011. The Orochi (UMPC/notebook) and Llano (mainstream desktop/notebook) chips will be the first to use AMD's next-generation Bulldozer core. The desktop chips will have four x86 cores and support four to eight Mbytes cache and DDR3 memory. The Llano chip will also include a graphics core.

Also in 2011, AMD will deliver Ontario, a 32nkm notebook chip with two x86 and one graphics core, supporting DDR3 memory.

Desktop/notebook Roadmap 2009-2010

AMD also provided details bout the CPU roadmap for mobile and desktop PCs for 2009/2010.

In 2009, the 45nm quad-core "Deneb" CPU (8m cache, DDR2/3) will power the entusiast desktop platforms. The "Propos" quad-core chips will be also available at that time featuring 2MB of cache and they will be found at mainstearm desktop PCs.

In the notebook segment for clients, AMD will release in 2009 the new 2-core "Caspian" CPU (2MB cache, DDR2) followed by the quad-core "Champlain" CPU (2MB cache, DDR3) in 2010. For ultramobiles, AMd prepares the "Conesus" (2-core, 1M cache, DDR2) chip for 2009 and the "Geneva" (2-core, 2M cache, DDR3) chip one year later.

Server roadmap

In the sever CPU segment, AMD did not announce new server/workstation products beyond the 6-core Istanbul and 8/12-core Magny-Cours and Sao Paulo CPUs that are scheduled for a 2009/2010 introduction.

Foundry plans

AMD also provided some insight into what The Foundry Company will be doing over the next couple of years.

AMD announced the spinning off of its manufacturing division in early October, and it plans to complete the operation early next year.

According to the plans, the Foundry will start producing silicon wafers next year and it will eventually manufacture chipsets and graphics processors for AMD.

Currently AMD is using the silicon-on-insulator process (SOI) technology to make its own CPUs at the Fab 36. Taiwanese TSMC and UMC are building graphics and chipsets using using bulk silicon (55nm/40nm):

The Foundry plans to start offering a bulk silicon process in the second quarter of 2009 with a 45nm bulk silicon process.

In 2010, all the Fab 36, Fab 38 and Fab 4x manufacturing plants of the Foundry company will produce CPU and x86 CPUs that have graphics processors built in (Accelerated Processing Units - APU) using both SOI and bulk silicon. For the same period, AMD plans to still partialy rely on TSMC/UMC for its GPUs, while the Foundry's Fab 38 plant will also take over bulk GPU production.

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