Thursday, September 03, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Updated Google Street View App Has 360-degree Images
Samsung Seeks Piece of Nascent Smartwatch Market With New Gear S2 Smartwatch
Ricoh Unveils Upgraded THETA S Spherical Camera
Barnes & Noble and Samsung Unveil New Samsung Galaxy Tab S2 NOOK
Sony Is Entering The Pico Projector Market
Intel Media Server Studio 2016 Enables Faster Video Transcoding and Transition to HEVC and 4K
JBL Expands Aftermarket Subwoofer Line-up, Promises Big Concert Sound From New Portable Bluetooth Speaker
AMD To Showcase Broadcast Ecosystem Workflows at IBC 2015
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > TSMC to...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 30, 2008
TSMC to Produce Chips Using 28nm Process by early 2010


TSMC , the world's biggest contract chip maker, said on Tuesday it would start using advanced 28-nanometer technology in early 2010 to produce CPUs, graphic processors and chips used in gadgets.

In a highly competitive foundry market, Taiwan Semiconductor Manufacturing Co Ltd (TSMC), United Microelectronics Corp (UMC) and other smaller rivals are racing to develop new process technology for chip production.

The company today unveiled its plans to deliver its 28nm process as a full node technology offering the option of both high-k metal gate (HKMG) and silicon oxynitride (SiON) material to support different customer applications and performance requirements.

The 28nm node will be a full node in TSMC?s manufacturing-flexible 28nm family, so named because it is the only family of processes at these geometries to offer either a HKMG or SiON transistor option.

"Product differentiation, faster time-to-market and investment optimization are the three most important values TSMC delivers to our customers. In support of these values, we are developing this comprehensive 28nm technology family so that it offers choices, depending on the customer applications and performance requirements. " said Jason Chen, vice president, Worldwide Sales and Marketing, TSMC.

The SiON-based 28LPT (low power / high performance) process, the family?s lowest total power and cost-effective technology, is expected to provide twice the gate density, up to 50% more speed or 30-50% lower power consumption than TSMCs? 40LP technology. The 28LPT process is expected to go into initial production in the beginning of 2010 and support applications like cellular baseband, application processors, wireless connectivity, and portable consumer.

TSMC?s decision to build on proven SiON technology for the 28LPT process is driven by changing wireless and portable consumer application dynamics under unrelenting pressure for products to hit market windows, the company said. Consumers a few years ago, wanted low-leakage handsets that supported long battery life. Today?s consumers increasingly rely on their wireless devices for Internet browsing, video streaming, music, mobile TV, GPS navigation, along with traditional phone and texting services. Active usage power consumption is now a much larger factor in battery life.

"SiON gate technology, because of its smaller gate capacitance and therefore lower active power than HKMG, provides a solution with lower total power, cost, and risk for power-limited applications," TSMC said.

"Our customers are really looking for a high performance, low active power, and cost-effective technology to meet their market requirements for their portable consumer products." said Dr. Mark Liu, senior vice president, Advanced Technology Business, TSMC.

The 28HP (high performance) process, TSMC?s first HKMG technology, will support performance-demanding applications such as CPU, graphic processors, and FPGAs with twice the gate density and over 30% higher speed than TSMC?s 40G process at similar power density, TSMC added.

Going forward, the HKMG technology is very promising for device scaling at even smaller geometries beyond 28nm. The 28HP process is expected to enter initial production in the first half of 2010. TSMC?s 28nm technologies are currently supported by alpha version design kits. The 28nm CyberShuttle, a prototyping service, will begin near the end of 2008 and features competitive cycle time and frequency. TSMC, which counts Texas Instruments and Nvidia among its major clients, has been driving process technology to advanced 90-, 65- and 45-nanometer. The company has been also believed to apply its 40nm process to chips manufactured for AMD, according to recent reports.


Previous
Next
MPAA, RealNetworks Battle Over RealDVD        All News        HD DVD Still Alive in the U.S
WD ShareSpace Storage Systems Up To 4 TB of Storage     PC Parts News      Corsair Introduces 64GB USB Flash Drive

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Used TSMC's Technology To Prevail In Chip Manufacturing Race
TSMC to Cease Solar Manufacturing Operations
TSMC Starts Mass Production Of 16nm Chips
TSMC To Move To 10nm Production in 2016
TSMC Solar Commercial-size Modules Achieve Record Efficiency
TSMC Start 10nm Manufacturing in mid-2016
TSMC Reports 65 pct Rise in Q1 Profit
TSMC Achieves EUV Productivity Milestone
TSMC Selling Sold ASML Stake
TSMC Sells LED Unit to Epistar
TSMC Chairman Sees Technical Hurdles In keeping Up With Moore's Law
TSMC To Make Intel's SoFIA Handset Chips

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .