Saturday, October 21, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
DVDFab Debuts 4K Ultra HD Copy Software
Razer Unveils New Broadcasting Camera and Microphone
Microsoft's Cortana Gets Into Smart Speakers Market With Harman Kardon Invoke
Samsung, LG Electronics are Lagging in Autonomous Car Race
TSMC Raises Forecasts for 2017 Due to 10nm Demand, Outlines 7 and 5nm Roadmap
Samsung Said to Have Placed Huge EUV Equipment Order From ASML
Samsung Launches the Ruggedized Galaxy Tab Active2 for Business
Intel Capital Announces $60 million of New Investments in Data-Focused Startups
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, November 27, 2007
Toshiba and NEC Announce Joint Development of 32nm Chips


Toshiba and NEC today announced that the companies have agreed to collaborate on the development of system LSI process technology for the 32-nanometer (nm) generation.

Toshiba and NEC Electronics have been working together on 45nm process technology development since February 2006 at Toshiba's Advanced Microelectronics Center in Yokohama. Under the new agreement, the two companies will extend the scope of their collaboration at the site to the 32nm generation, with the aim of accelerating development and sharing development costs.

At the 32nm generation, advanced technologies and significant development resources are required to secure improvements in performance and power consumption. As a result, global semiconductor companies are responding by establishing alliances to achieve more resource-efficient development of process technologies. Toshiba and NEC Electronics have decided to combine their efforts in process technology development for production of devices based on 32nm technology.

The development of derivative and differentiated process technologies will be discussed separately by the two companies. Additionally, Toshiba and NEC Electronics continue to discuss joint manufacturing, and expect to reach a decision concerning this in 2008.

Samsung, IBM, Chartered Semiconductor Manufacturing Ltd., Infineon Technologies, STMicroelectronics and Freescale Semiconductor have also said they would work through 2010 to develop and produce 32-nanometre chips.


Previous
Next
Fujitsu to Release 2.5" HDD with 320 GB Capacity        All News        WD Adds 500GB Model to GreenPower Family of Desktop Hard Drives
Fujitsu to Release 2.5" HDD with 320 GB Capacity     PC Parts News      WD Adds 500GB Model to GreenPower Family of Desktop Hard Drives

Get RSS feed Easy Print E-Mail this Message

Related News
New Toshiba TR200 3D NAND SSDs Offer an Affordable Alternative to Hard Disks
Toshiba to Further Invest in Production Equipment for Fab 6 at Yokkaichi Operations
Western Digital Provides Its Aspect on Latest Developments Related to the Sandisk JV with Toshiba
Toshiba Signs Deal to Sell Chip Unit to Bain-led Group
SK Hynix to Invest 395 billion yen in Toshiba chip unit
Western Digital Tries to Block Toshiba's $18 Billion Memory Chip Unit Sale
Toshiba MG06 Series Includes 10TB Enterprise Capacity SATA HDD
Toshiba Formalizes Chips Sale to Bain Consortium, WD Steps up Legal Action
Toshiba Has Chosen Japan-U.S.-South Korea Group For its Chip Unit
Apple Could be Behind Toshiba's MoU With Bain Capital's Consortium
Toshiba Signs Memorandum to Accelerate Memory Chip Sale Talks With Bain-Sk Hynix Group
Toshiba in Ongoing Discussions for Chip Business Sale

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .