Saturday, October 25, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Panasonic to Offload Sanyo's North America TV Business
Google's Pichai to Become Head of Product at Google: report
Internet Explorer 11 Toolkit Allows Enterprise Admins "Spy" On Their Employees
FCC Says Airwave Auction To Delay Until 2016
HP Broadens Moonshot Portfolio With Intel-powered Models
Microsoft To Keep Nokia Brand For Low-end Smartphones
LG Introduces Its First Octa-Core Application Processor
Cloud and Surface 3 Drive Microsoft's Revenue
Active Discussions
Copied dvd's say blank in computer only
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
 Home > News > Mobiles > NXP and...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, November 14, 2007
NXP and Sony Create Moversa, a Joint Venture For Universal Contactless Solutions


NXP and Sony today announced the formation of Moversa, a joint venture that will promote contactless smart card applications in mobile phones using Near Field Communication (NFC).

Moversa will plan, develop, produce and market a chip, a Universal Secure Access Module (U-SAM), that incorporates both MIFARE and FeliCa operating systems and applications, two of the most widely installed contactless smart card technologies in the world. The U-SAM will also support other contactless operating systems and applications based on customer requirements.

Moversa will be headquartered in Vienna, Austria, and led by co-presidents Guus Frericks of NXP and Toshio Yoshihara of Sony.

The companies believe that the formation of Moversa will accelerate the adoption of NFC on a global level.

Moversa paves the way for consumers to use mobile handsets for various contactless applications such as mobile payments and transport ticketing, anytime, anywhere. The U-SAM products will provide mobile device manufacturers with the technology to design global products compatible with different contactless protocols and operating systems deployed in different countries. This enables service providers such as mobile phone operators, transportation network operators and credit card companies to accelerate the rollout of advanced contactless services to mobile phone users.

First samples of the secure chip will be available by mid-2008 for solutions embedded in mobile phones. Initial commercial deployments are targeted for the end of next year.

NXP and Sony said that they will continue to offer chips and applications based on their respective technology platforms MIFARE and FeliCa, while developing NFC technologies jointly.


Previous
Next
Microsoft Unveils Windows HPC Server 2008        All News        DaTARIUS HD and BD Signal Guide Version 1 Released
700MHz Spectrum Auction Could Transform US Mobile Landscape     Mobiles News      Infineon, Intel to Jointly Develop SIM Chips

Get RSS feed Easy Print E-Mail this Message

Related News
Sony To Release Android Lollipop To Its Entire Xperia Xperia Z Series
New Sony Headphones, Portable Headphone DAC/Amplifier and Headphone Cables Support Hi-Resolution Audio
Sony Xperia Z3 Coming To The US
PlayStation TV Coming October 14th
Sony Develops SmartEyeglass, Launches SDK
Sony To Offer Unity For PlayStation To PlayStation Licensed Developers
Sony Slashes Guidance Due To Poor Smartphone Sales
Sony Smart EyeGlass Prototype Appears At IFA
New Sony Camera Shoots In The Dark
Sony Unveils New Xperia Z3, Z3 Compact And More at IFA
Sony PSN Back Online
Sony Offers New Smart Tennis Sensor

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .