Wednesday, May 24, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Moderate GPU Sales in the First Quarter
Google To Employ Machine Learning To Ad Analytics
Crucial to Debut 128GB DDR4 LRDIMM Server Memory
Kodak EKTRA Camera-First Smartphone Launches in the United States
Huawei Unveils New Series of MateBook Devices
New Surface Pro Is Starting at $799, Windows 10 China Government Edition Anounced
GLOBALFOUNDRIES and Chengdu Invest in China-based FDX FD-SOI Design Centers
Researchers Develop "Value-Aware" SSD OPtimized For Image Recognition Systems
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Sony, T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, December 14, 2006
Sony, Toshiba, NEC Electronics Develop 45nm Chip Platform


Sony, Toshiba and NEC Electronics Corp., said on Thursday they had jointly developed technology to mass produce cutting-edge chips.

The platform developed by the three Japanese companies will be used to make system chips, which combine multiple functions on a sliver of silicon, using 45-nanometre technology, the firms said in a joint press release. This technology was unveiled on December 13 (US Pacific Standard Time) at Session 27.2 of the 2006 International Electron Devices Meeting (IEDM) in San Francisco, CA.

Chip makers worldwide are locked in a race to lower production costs on 90-, 65- and 45-nanometre chips, with the smaller circuitry widths allowing more power per chip for complex devices.

The three companies are developing a platform for low-power system chips, to be completed in early 2007.

Toshiba and NEC Electronics are also working to standardize technology to make advanced chips with circuitry width of 45-nanometres or finer with Fujitsu and Renesas Technology Corp.

The key elements of the new platform are a fully renovated MOSFET integration scheme, and a hybrid structure with a low dielectric constant (low-k) film that assures high performance and reliability.

The MOSFET integration process applies strained silicon technology to the transistor, utilizing crystal lattice distortion to induce performance-boosting local strain at key locations. Optimization of the strain boosts transistor performance to a level 30% faster than that achieved in the present generation of technology.

Application of a low-k film in the intermediate metal layer of the chip during the back-end process reduces parasitic capacitance and improves circuit performance. The three partners confirmed a dielectric gate film with an effective 15-year lifetime, a span surpassing the average lifetime of a high performance LSI. They also carried out tests of the platform and proved a layer yield of over 98% for the challenging back-end process, confirming that the technology achieves the reliability essential for mass production.

In addition, the partners have led the industry in applying immersion lithography technology with an ultra-high numerical aperture (NA) of over 1.0 to formation of the transistor node, achieving a cell with an area of 0.248 micron m2 in an ultra high density SRAM. The new cell is the smallest yet achieved.

The three companies are simultaneously developing two 45nm processes -- the current platform, which is ideal for high performance LSIs, as well as a platform for applications with low power consumption requirements, which is expected to be completed in early 2007.


Previous
Next
DaTARIUS DaTABANK Reads BD-ROM Mark        All News        ATI Releases Catalyst 6.12 Drivers
NXP Semiconductors Introduced Two PC TV Processors     PC Parts News      BenQ to Debut Full Line of 2007 Widescreen LCD Monitors for Gamers

Get RSS feed Easy Print E-Mail this Message

Related News
Sony Chief Promises Return to Profitability
Broadcom, KKR and SK Hynix - Bain Join Final Bidding Round for Toshiba's Memory Unit
Western Digital Takes Legal Action Against Toshiba to Block Sale Of Memory Chip Business
Sony Returns to the OLED TV Market With New Models
Toshiba Tells Western Digital To Stop Messing Up With Chip Unit Sale
Toshiba Demonstrates 64-Layer BiCS FLASH on Client NVM Express SSD
Image Sensors, Batteries And Playstation Boosts Sony's Profit
Toshiba to Spin Off 4 Operations
Questions Remain About The Fate Of Toshiba's HDD and SSD Business
Toshiba's Shareholders Seek For New Compensatory Damages
Sony Launches The a9 24MP 20fps Full-frame Sports Camera
Toshiba's New 8TB Consumer Hard Disk Focuses on Reliability

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .