Hynix Semiconductor announced the availability of DRAM first JEDEC standard 8GB DDR2 registered dual in-line memory modules by utilizing the company's multi-die stacking technology. Hynix has begun sampling the 8GB DDR2 R-DIMMs for high-end server applications. The new modules consist of 36 2Gb dual die package (DDP) devices and a total of 72 die by utilizing Hynix's multi-die stacking technology. The Hynix 2Gb DDP devices utilize two 1Gb DDR2 SDRAM die based on the company's 0.10-micron process technology in one package.

Hynix's new DDR2 R-DIMMs can meet the JEDEC standard of 30.35mm module width and 133.35 mm height, maximizing memory capacity to 8GB. Currently, other 8GB DDR2 R-DIMMs already available in the market place are extended-size Tall-DIMMs.