Tuesday, August 04, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Toshiba Announces Third Generation of Enterprise SAS SSDs, Starts Production Of 3D NAND
Xiaomi Has Reclaimed Top Spot in China, Huawei Pushes Ahead of Apple
Older Noctua Heatsinks To Support Upcoming Skylake Ptrocessors
Sony's Midrange Xperia C5 Ultra and M5 Smartphones Come With Strong Cameras
Photos of Upcoming Samsung Phablet Appear Online
Lattice Releases First superMHL Solutions for USB Type-C
AUDI AG, BMW Group and Daimler AG To Buy Nokia's HERE Digital Mapping Business
AT&T To Offer Wireless Service And DirecTV's Pay-TV Offerings
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > Hynix I...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, November 16, 2005
Hynix Introduces DRAM First JEDEC Standard 8GB DDR2 R-DIMMs


Hynix Semiconductor announced the availability of DRAM first JEDEC standard 8GB DDR2 registered dual in-line memory modules by utilizing the company's multi-die stacking technology.

Hynix has begun sampling the 8GB DDR2 R-DIMMs for high-end server applications. The new modules consist of 36 2Gb dual die package (DDP) devices and a total of 72 die by utilizing Hynix's multi-die stacking technology. The Hynix 2Gb DDP devices utilize two 1Gb DDR2 SDRAM die based on the company's 0.10-micron process technology in one package.

Hynix's new DDR2 R-DIMMs can meet the JEDEC standard of 30.35mm module width and 133.35 mm height, maximizing memory capacity to 8GB. Currently, other 8GB DDR2 R-DIMMs already available in the market place are extended-size Tall-DIMMs.


Previous
Next
New ASUS Main Station Motherboard Series Incorporates Intel 975X Chipset        All News        Ballmer: Vista to Support HD DVD Format
New ASUS Main Station Motherboard Series Incorporates Intel 975X Chipset     PC Parts News      VIA to Develop CPUs, Sees Off Intel

Get RSS feed Easy Print E-Mail this Message

Related News
SK Hynix Launches UFS 2.0 Solution
Rambus and SK Hynix Extend Their License Agreement
SK Hynix To Start Production Of 36-Layer 3D NAND Flash Chips
SK hynix To Start Producing 20nm DRAM This Year
LG Display, SK Hynix Benefit From Strong iPhone Sales
SK Hynix Reports Record Profit
SK Hynix Develops High Density 16GB NVDIMM
SK hynix Develops The Fastest Mobile DRAM
SK Hynix To Develop Its Own eMMC Controllers
SK Hynix Starts Mass Production of 16nm NAND Flash
SK hynix And Micron May Be Close To Licensing Deal
Fire At Hynix Factory Spurs Bigg Chip Price Rise

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .