Chips will drive VoWLAN into mobile phones
Texas Instruments Inc. (TI) announced its WiLink mobile Wireless LAN (mWLAN) platform, which will include the TNETW1251 and TNETW1253 devices to provide Voice over WLAN (VoWLAN) to mobile phones.
The TNETW1251 is 802.11b/g single chip, while the TNETW1253 is an 802.11a/b/g single-chip device. The platform includes a software package and the WiLink 4.X Software Development Kit (SDK).
The devices will be manufactured in a 90nm advanced RF-CMOS process and use the company's DRP technology. The design integrates the media access controller (MAC), baseband and RF transceiver functions in a single 6-by-6mm BGA package. The two chips are pin-for-pin compatible.
The software development kit includes a "Thick MAC" architecture which off-loads some of the host processing functions to the single chips which enables WLAN support on low-end CPU host processors commonly found in low-end mobile phones. The product supports CCx3.0 and CCx4.0, Unlicensed Mobile Access (UMA) and the emerging 3GPP IMS and SIP standards. It includes enhancements to provide WLAN handoff between access points (APs) within a WLAN network.
The 802.11b/g and 802.11a/b/g products support IEEE and industry standards for security and quality of service, including 802.11i, 802.11d, 802.11k, WPA2.0 and WME/WSM. They also include support for 802.11h and 802.11j for 802.11a operation.
The WiLink 4.0 mobile WLAN 802.11b/g and 802/11a/b/g solutions are expected to sample in 3Q 2005. Products integrating the WiLink 4.0 platform are expected to be released into the market by 2Q 2006.
The devices will be manufactured in a 90nm advanced RF-CMOS process and use the company's DRP technology. The design integrates the media access controller (MAC), baseband and RF transceiver functions in a single 6-by-6mm BGA package. The two chips are pin-for-pin compatible.
The software development kit includes a "Thick MAC" architecture which off-loads some of the host processing functions to the single chips which enables WLAN support on low-end CPU host processors commonly found in low-end mobile phones. The product supports CCx3.0 and CCx4.0, Unlicensed Mobile Access (UMA) and the emerging 3GPP IMS and SIP standards. It includes enhancements to provide WLAN handoff between access points (APs) within a WLAN network.
The 802.11b/g and 802.11a/b/g products support IEEE and industry standards for security and quality of service, including 802.11i, 802.11d, 802.11k, WPA2.0 and WME/WSM. They also include support for 802.11h and 802.11j for 802.11a operation.
The WiLink 4.0 mobile WLAN 802.11b/g and 802/11a/b/g solutions are expected to sample in 3Q 2005. Products integrating the WiLink 4.0 platform are expected to be released into the market by 2Q 2006.
