Samsung today announced the development of 1 gigabit (Gb) mobile DRAM with a wide I/O interface, using 50 nanometer class process technology. The new wide...

Rambus has advanced differential signaling for SoC-to-memory interfaces to a 20 gigabits per second (Gbps) and developed innovations which can extend single-ended memory signaling to...

Japanese PC memory maker Elpida Memory and Taiwan's Powerchip Technology have reached a non-binding understanding that Elpida will purchase all DRAM products that Powerchip will...

Renesas Electronics today announced the development of a basic structure for embedded DRAM (eDRAM) highly compatible with standard logic circuit design assets of the next...

Samsung Electronics announced today that it has developed and started sampling the industry's first monolithic four gigabit (Gb), low power double-data-rate 2 (LPDDR2) DRAM using...

Elpida Memory has begun sample shipments of its new 32-gigabyte Load Reduced Dual In-Line Memory Module (LRDIMM), the DRAM industry's highest density memory module. The...

Infineon Technologies AG today announced that it has settled its patent infringement claim against Elpida Memory Inc., and both Infineon and Elpida have agreed to...

The European Commission today adopted its first settlement decision in a cartel case involving 10 producers of memory chips or DRAMS used in computers and...

Asustek Computer Inc., is expected to buy the majority stakes ASint Technology Corp., a memory supplier owned by Silicon Integrated Systems Corp. (SIS), in an...

The U.S. International Trade Commission (USITC) has voted to institute an investigation of certain dynamic random access memory semiconductors and products containing the same, including...