Toshiba Memory Launches Faster NAND Flash Memory Products for Embedded Applications

Toshiba Memory Corporation has launched its second-generation line-up of NAND flash memory products for embedded applications with increased performance and capacity.

The new Serial Interface NAND products are compatible with the Serial Peripheral Interface (SPI) and are suited for a wide range of consumer, industrial and communication applications.

Toshiba is starting sample shipments today with mass production scheduled to begin from October onwards.

Due to its compatibility with the widely used SPI, the Serial Interface NAND products can be utilized as SLC NAND flash memory products with a low pin count, small package and large capacity.

In order to support high-speed data transfers, the new second-generation Serial Interface NAND products offer improved performance compared to existing first-generation products, including 133 megahertz (MHz) operating frequency and program x4 mode. Furthermore, an 8 gigabit (1 gigabyte) device has been added to the line-up to respond to demands for larger memory capacity.

Outline of the New Products

Part Number	Capacity	I/O	Voltage	Package	Mass Production
TC58CVG0S3HRAIJ	1Gb	x1, x2, x4	3.3V	8pin WSON (6mm x 8mm)	Oct. 2019
TC58CYG0S3HRAIJ	1Gb		1.8V		Oct. 2019
TC58CVG1S3HRAIJ	2Gb		3.3V		Oct. 2019
TC58CYG1S3HRAIJ	2Gb		1.8V		Oct. 2019
TC58CVG2S0HRAIJ	4Gb		3.3V		Oct. 2019
TC58CYG2S0HRAIJ	4Gb		1.8V		Oct. 2019
TH58CVG3S0HRAIJ	8Gb		3.3V		Dec. 2019
TH58CYG3S0HRAIJ	8Gb		1.8V		Dec. 2019

Key Features

Capacity	1Gb, 2Gb, 4Gb, 8Gb
Page Sizes	2KByte (1Gb, 2Gb), 4KByte (4Gb, 8Gb)
Interface	Serial Peripheral Interface Mode 0, Mode 3
Power Supply Voltage	2.7 to 3.6V, 1.7 to 1.95V
Operating Temperature Range	-40 oC to 85 oC
Features	133MHz Operating Frequency Program / Read x4 mode High-Speed Sequential Read Function ECC Function (ON/OFF, bit flip count report) Data Protection Function (able to protect specific blocks) Parameter Page Function (able to output detailed information on the device)

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