MediaTek and Qualcomm are both set to release their next-generation mobile SoCs using advanced process nodes and supporting more advanced technologies.

MediaTek will upgrade its Helio P- (P90) and Helio A-series application processors in 2019, with some models to target the high-end smartphone segment. The Taiwanese company has already added AI-based functionalities in its in-house developed tri-cluster and heterogeneous computing technologies.

The company is slated to roll out is Helio M70 5G modem chips in the first quarter of 2019, built using a 7nm process at Taiwan Semiconductor Manufacturing Company (TSMC).

At the same time, Qualcomm is also implementing an upgrade program by adding AI-centric functionalities into its Snapdragon 800, 700, 600 and 400 series CPUs.

The company will build its next-generation high-end solutions with a 7nm process at TSMC in order to pursue high price/performance ratios for its new chips, while continuing to fabricate the SoCs for the entry-level and mid-range smartphones with a 11nm process by Samsung Electronics foundry.

Qualcomm will also release integrated 5G solutions with antennas and modems, which in turn will help shore up the ASPs of its 5G chips.

The company is holding the third annual Snapdragon Technology Summit in Hawaii on December 4, 5 and 6. This year’s summit will feature a number of announcements of industry milestones on the path to the commercialization of 5G in 2019, Qualcomm Snapdragon Mobile Platform and the always on, always connected PC.