Toshiba has started sample shipments of a 64GB embedded NAND flash memory module, the first equipped with a UFS I/F.
The module is fully compliant with the JEDEC UFS Ver.1.1 standard and is designed for digital consumer products including smartphones and tablet PCs.
The 64GB NAND flash memory chip boasts with ultra-speedy 3.0Gb/s interface. The module is sealed in a small FBGA package, 12x16x1.2mm, and have a signal layout compliant with JEDEC UFS Ver.1.1.
Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software.
Toshiba is offering the samples to OC vendors in order to evaluate the UFS I/F and its protocol in host chipsets. UFS I/F has a serial I/F, offreing scalability in the number of lanes and speed.
Toshiba has not yet decided when it will start mass production of the new 64GB UFS module.
Interface: JEDEC UFS Version 1.1 standard
Power Supply Voltage:
2.7V to 3.6V (Memory core)
1.70V to 1.95V (Controller core)
1.10V to 1.30V (UFS I/F signals)
Number of lanes: Downstream 1 lane / Upstream 1 lane
I/F Speed: 2.9Gbps/lane
Temperature range: -25 degrees to +85 degrees Celsius
Package: 169Ball 12x16x1.2mm FBGA