Taiyo Yuden today announced the commercialization
of its embedded-parts multilayer wiring substrate
"EOMIN" (Embedded Organic Module Involved
Nanotechnology), which incorporates a copper core
technology developed to accommodate multiple built-in
ICs.
The product is an embedded-parts multilayer wiring
substrate for camera modules which are mounted in
compact mobile devices such as smartphones, and achieves
power and control functions for the camera module within
a space of just 8.3 x 8.3 x 0.38mm (the substrate
thickness) through the integration of multiple ICs. This
has allows a significant reduction of the size of such
camera modules.
In addition, with the low profiling of the copper core
with its "EOMIN" features, Taiyo Yuden's conventional
substrate thickness has been reduced by about 20% -
from 0.48mm to 0.38mm - further contributing to the
development of low profile smartphones.
The Japanese company plans to further develop ts
technology towards the miniaturization of low profile
devices.
EOMIN Features
Low noise
An improvement in tolerance to noise due to the
shielding effect from the copper core
Highly heat radiation
The high thermal conductivity of the copper core
effectively dissipates heat coming from IC chips, etc.
Stiffness
Constructed with a built-in copper core, the rigidity of
the module itself is increased
Reliability
Jointed with embedded parts by electrolytic copper
plating