Friday, May 25, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon Admits Alexa Eavesdropped and Shared Conversation
Twitter and Facebook Reveal Measures to Bring Transparency to Political Ads
Lenovo's PC Sales Shows Signs of Life, Although Smartphones Sales Remain Low
Uber's Self-driving Recognized Pedestrian Late and Failed to Brake: NTSB
Qualcomm Snapdragon 710 Mobile Platform Brings Artificial Intelligence Features to a New Tier of Smartphones
Intel Nervana NNP-L1000 Neural Network Processor Coming in 2019
Uber Ends Arizona Self-driving Program
Apple to Offer $50 Rebates for iPhone Battery Swaps
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Intel E...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, March 01, 2018
Intel Eyes China Partnerships As Flash Memory Pact With Micron Ends


Micron and Intel have announced that they will part ways after finishing the development of 96-layer 3D-NAND flash, and Intel will reportedly seek for new partnerships in China.

Last January, Micron and Intel announced that they will discontinue their partnership on NAND Flash development after completing the development of the third generation of 3D-NAND Flash. The two companies are currently developing the second generation (64-layer), and the third generation is expected to reach 96-layer.

According to DRAMeXchange, a division of TrendForce, Intel and Tsinghua Unigroup are now discussing over further collaboration in product offerings and sales.

DRAMeXchange says that the Chinese market has been a major focus for Intel, who has been actively seeking different opportunities of cooperation and joint venture for various product lines, including CPU, modem and memory products. In addition, Intel has been expanding its production capacity in China, and its fab in Dalian has entered production of 3D-NAND Flash. The fab's capacity is expected to rise continuously. Recently, Intel and UNIC Memory Technology, the storage business under Tsinghua Unigroup, are now discussing on long term cooperation, says DRAMeXchange. Under the agreement, UNIC will be responsible for products testing, packaging and selling based on NAND wafers provided by Intel.

Tsinghua Unigroup has deployed a roadmap in flash memory industry. Yangtze Memory Technologies Company (YMTC), another company under Tsinghua Unigroup, will be responsible for flash memory products development, design and production, while UNIC will be responsible for selling. But due to the fact that the products designed by YMTC are still 32-layer-based, Intel will provide wafer for flash memory products to UNIC monthly before YMTC manages to formally offer products of 64-layer or greater. With the Intel's NAND wafers, UNIC will be able to produce UFS, eMMC, and other SSD products.

This solution will not only make UNIC more competitive in channel sales, but also increase the presence of the brand in market. Although YMTC and UNIC cannot immediately cut into the middle- and high-end smartphone markets or become competitive in client SSD sector, their products are likely to be adopted by Chromebooks or other consumer electronics, which may influence the overall prices trend of NAND flash in the future.



Previous
Next
China Is Raising Up to $31.5 Billion to Fuel Home-grown Semiconductors        All News        TDK to Buy Ultrasonic Sensor Developer, Invests in Battery Startup StoreDot
China Is Raising Up to $31.5 Billion to Fuel Home-grown Semiconductors     PC Parts News      Personal Computing Device Market Expected to Decline through 2022

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Nervana NNP-L1000 Neural Network Processor Coming in 2019
IBM Crypto-Anchor Verifier, an AI-enabled Scanner for Visual Clues that Prove an Item's Authenticity
Samsung Opens Global AI Centers in the U.K., Canada and Russia
Intel's Powerful 8-core Mainstream Processor Appears in SISoftware Benchmarks
Microsoft Acquires Conversational AI Company Semantic Machines
Intel Announces First Xeon Scalable Processor with Integrated Intel Arria 10 FPGA
Samsung Extends its Semiconductor Sales Lead over Intel
Intel Releases OpenVINO Toolkit for Computer Vision Applications
Intel's First 10nm Cannon Lake Core i3-8121U Processor Confirmed
Intel Briefs Upcoming Z390 Chipset
Intel Seeks to Advance Probabilistic Computing
Intel and Packet to Offer Free Access to Optane SSDs

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .