Sunday, March 29, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Microsoft Lists Windows 10-Compatible Phones
Intel in Talks to buy Altera: report
MediaTek Releases New High-end Smartphone Helio SoC
Google To Get Into The Operating Room
Data Requests To Microsoft Decreased
Google Defeated in English Court - Decision Opens Door for Litigation by Millions of British Apple Users
LG G4 Smartphone Coming Late April
BlackBerry Posts Quarterly Profit
Active Discussions
how to copy and move data files to dvd-rw
cdrw trouble
Need serious help!!!!
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, August 27, 2014
Samsung Starts Mass Production Of First 3D TSV DDR4 Modules


Samsung has started mass producing the first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class process technology and 3D TSV package technology.

Samsung's has also started producing 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology embraces high-rise vertical structures of cell arrays inside a monolithic die, 3D TSV is an innovative packaging technology that vertically interconnects stacked dies.

To build a 3D TSV DRAM package, the DDR4 dies are ground down as thin as a few dozen micrometers, then pierced to contain hundreds of fine holes. They are vertically connected through electrodes that are passed through the holes. As a result, the new 64GB TSV module performs twice as fast as a 64GB module that uses wire bonding packaging, while consuming approximately half the power.

In the future, Samsung believes that it will be able to stack more than four DDR4 dies using its 3D TSV technology, to create even higher density DRAM modules.



Previous
Next
Larger iPad Coming Next Year        All News        HP Recalls Millions Of Power Cords
Larger iPad Coming Next Year     PC Parts News      HP Recalls Millions Of Power Cords

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Listed In Nvidia's Chip Providers
Corsair Releases Dominator Platinum DDR4 3400MHz Memory
Samsung to Bring Microsoft Services on More Devices
Samsung Expands Its Lineup of Curved Monitors
Samsung Demonstrates Enterprise Platforms at CeBIT 2015
Samsung Strengthens Its SSD Business With New Apple Macbook Deal
Kingston DDR4 SO-DIMMsValidated For Intel Xeon Processor D-1500 Product Family
Samsung Expands Digital Display Portfolio with YESCO Electronics Acquisition
HyperX Releases FURY And High-capacity Predator DDR4 Kits
Samsung Lost Top Position to Apple in Q4's Global Smartphone Market
Samsung Releases New Image Sensor and NFC IC For Mobile Devices
Crafted from Metal and Glass, Samsung Galaxy S6 and Galaxy S6 Edge Are Here

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .