Wednesday, September 02, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
This Is Google's Redesigned Logo
Instagram Gets New Features
Alliance for Open Media To Deliver Open Standard for Online Ultra High Definition Video
Seagate Develops High Density Mobile Hard Drive Technology, New Portfolio of 8TB Hard Drives
Apple To Work With Cisco On Enterprise Environment; said To Prepare Own Original Programming
Qualcomm Snapdragon 820 Processor To Geature Mobile Anti-malware Technology
WD My Cloud OS 3 Makes Cloud Storage More Personal
Samsung's Circular Gear S2 Smartwatches Unveiled
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, July 31, 2014
Toshiba, Samsung Vie For 48-layer 3-D NAND Chips


Two of the world's major NAND flash memory chip makers -- Toshiba and Samsung Electronics -- are competing against each another on the development and commercialization of next-generation 3-D memory chips.

NAND flash memory chips are used in smartphones and PCs.

While conventional memory chips basically consist of one layer of memory elements, 3-D chips are made by stacking up dozens of thin layers of memory elements. This multiple-layer method helps expand memory capacity dramatically. Toshiba is aiming to produce NAND memory chips capable of storing 1 terabyte of data by fiscal 2019.

The more layers 3-D memory chips have, the larger their memory storage capacity will become. Both companies have yet to disclose their developmental status, but unconfirmed reports claim that they have achieved 24 layers last year and are expecting to develop 32-layered memory chips this year.

Thought 3D chips are still in the developmental stage, industry experts point out that conventional two-dimensional memory chips still offer more advantages at present. Observers say that both Toshiba and Samsung are looking to achieve 48 layers in 2015 and are now rushing to turn out truly next-generational memory products ahead of their main competitor.



Previous
Next
AMD Introduces New Kaveri APUs for System Builders        All News        Sony Reports First Quarter Profit
Lite-On IT Merged With Lite-On     General Computing News      Sony Reports First Quarter Profit

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Rolls Out Line-up of V-NAND SSDs For Data Centers
Samsung Begins Mass Producing 256-Gigabit, 3D V-NAND Flash Memory
SK Hynix To Start Production Of 36-Layer 3D NAND Flash Chips
Micron and Intel Unveil New 3D NAND Flash Memory
Toshiba, Sandisk, Develop First 48-layer 3D NAND For SSDs
Intel-Micron 3D NAND To Have 32 Layers, 256Gb Per Die
Samsung Announces High-endurance 128Gb V-NAND Flash Memory For Enerprise SSDs
3D-NAND Flash Development To Accelerate Next Year
3-D Drives Next-Generation NAND Flash

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .