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Thursday, July 10, 2014
Samsung to Strengthen Its LSI Business, New Exynos SoC Coming Soon


Samsung is teasing on Twitter with the upcoming announcement for what's likely to be a new Exynos SoC.

The official announcement is coming possiby later today.

Samsung's Exynos ModAP, a quad-core SoC built on the HKMG 28nm process that includes an integrated LTE modem which supports the Cat 4 LTE as well as legacy 2G and 3G. The chip also has a built-in image sensor that can support shooting photos at 8MP and recording video at 1080p.

Samsung is expected to strengthen non-memory or logic chips, as compared to the memory chip segment, the non-memory company's sector lagged behind in the first quarter.

Speaking to the Korea Times, Samsung Electronics Vice Chairman and co-CEO Kwon Oh-hyun said that "we should look back whether we are self-complacent as we are No. 1 in the memory chip segment. We must produce achievements in both the memory and non-memory segment to become a truly No. 1 chipmaker."

The company's System LSI or large-scale integration business segment includes development of application processors.

Samsung supplies some logic chips to Qualcomm, NVIDIA, Apple and Sony on a contractual basis.

However, Apple has been consistently cutting its heavy reliance on Samsung's DRAM and NAND chips amid their ongoing legal battle, although it still outsourced its A-branded processors to Samsung.

Samsung has also failed to win more orders from Apple, recently, as Taiwan's TSMC is attracting Apple with better pricing and output commitment, further threatening Samsung. The Wall Street Jornal's sources claim that TSMC has already started shipping next-generation 20nm microprocessors for Apple?s devices (A8) in the second quarter.



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