Wednesday, November 22, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
FCC Chief's Proposal Reverses the Net netruality Rules
Facebook Messenger Gets Support for 4K Photos
Broadcom Announces 7nm IP for ASICs in Deep Learning and Networking Applications
Justice Department Sues to Stop AT&T - Time Warner Deal
Apple Removes Skype and Other Apps in China
Android Collects Android Users' Locations Using Cell-tower Data
GPU Shipments in Q3: AMD Increased 8 percent, Nvidia Increased 30 Percent
Samsung Says New SZ985 Z-NAND SSD Offers Ultra-Low Latency and High Throughput
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Intel O...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, April 03, 2014
Intel Outlines New USB 3.1 Type-C Connectors, Braswell Chip at IDF 2014


Intel is preparing a new 14nm "Braswell" SoC to succeed its Bay Trail processor for affordable Chrome OS and Android devices. In addition, the company talked about the forthcoming USB Type-C cable for small form-factor platforms at IDF Shenzhen, China.

Intel did not provide many details on the 14nm successor to its budget 22nm Bay Trail processors. Dubbed Braswell, this new SoC architecture is mainly aimed at the likes of affordable Chrome OS, Android devices, entry-level desktops, notebooks and convertibles. Intel says that is is working on bringing over 20 Chromebook designs to the market this year.

Braswell is expected to offer better performance and power efficiency than the Bay Trail chips used in today's value-segment PCs and tablets.

Intel is also updating its Bay Trail chips for tablets by reducing the components and the cost of the processors. In this year's second half, the company will add performance upgrades to Bay Trail, including better graphics, and more security features.

Intel also talked about the next generation of USB connector, dubbed USB Type-C connector.

Built initially on existing USB 3.1 (10Gbps) and USB 2.0 technologies, USB Type-C is being developed to help enable thinner and sleeker product designs.

Key characteristics of the USB Type-C connector and cable solution include a new design tailored to work well with emerging product designs; a similar in size to the existing USB 2.0 Micro-B; usability enhancements - users will no longer need to be concerned with plug orientation/cable direction; support for scalable power charging and; scalability - the connector design will scale for future USB bus performance.



As the new USB Type-C plug and receptacle will not directly mate with existing USB plugs and receptacles (Type-A, Type-B, Micro-B, etc.), the Type-C specification will define passive new-to-existing cables and adapters to allow users to use their existing products.

The USB Type-C connector has an opening of ~ 8.3 x 2.5mm. Its durability is 10,000 cycles and has improved EMI and RFI mitigation features. Its power deilivery capacity will be 3A for standard cables and 5A for the connectors.

The USB Type-C specification is expected to be published by the middle of 2014.

In addition, Intel said that the USB 3.1 protocol will be used for transfering audio and video. Dubbed USB AV, it could e used to replace all the video and audio connectors and cables, for battery charging, enables bi-directional transfer controll and simultaneous streaming. ANd compared to HDMI, the USb cabes are cheaper.

In terms of bandwidth, USB AV 3.1 has the same bandwidth as HDMI 1.4 (10.2 Gbps), meaning it it supports 4K/30p and also packs HDCP.




Previous
Next
Fujitsu Launches New GS21 Series Mainframes Featuring New Processors        All News        Dell Introduces Latitude Rugged Extreme Lineup
Fujitsu Launches New GS21 Series Mainframes Featuring New Processors     PC Parts News      Dell Introduces Latitude Rugged Extreme Lineup

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Forecast to Top Intel as Larger Semiconductor Supplier in 2017
Intel Doubles Capacity of the Optane SSD DC P4800X
AMD's Raja Koduri Joins Intel as Chief Architect for High-End, Discrete Graphics Solutions
New Intel Core Processor Combines High-Performance CPU with Custom Discrete Graphics from AMD
Intel to Add AMD Radeon Graphics to New Laptop Processor
Intel Launches the Blazing-Fast Optane 900P SSD
Intel Raises Full Year Revenue, Profit Forecast
ARM-based Intel Stratix 10 FPGA Launches for 5G, NFV and Data Centers
Intel Capital Announces $60 million of New Investments in Data-Focused Startups
Intel Health Application Platform Helps Health Care Providers Reduce Hospital Readmissions
Globalfoundries and Intel to Talk About 10, 7nm at IEDM
Intel and Mobileye Offer Present Algorithms to Prove the Safety of Autonomous Vehicles

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .