Saturday, June 25, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
China to Regulate Search Results Ads
HTC Apologizes For Poor Results, Pins Hopes On VR
MediaTek To Invest $6.15 billion on 5G Communication Technologies
EU, United States Strengthen Data Transfer Pact
BitTorrent Now Music And Video App Launched
Qualcomm Files Complaint Against Meizu
3-D pens And Moldable Earbuds Appear At CE Week Gadget Show
HP Recalls Batteries for HP and Compaq Notebook Computers Due to Fire and Burn Hazards
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, March 03, 2014
Toshiba Develops TransferJet-Compatible 3D-Integrated Ultra-Small Module


Toshiba has developed a very small wireless communication module and a thin flexible printed circuit (FPC) coupler compatible with TransferJet, the close-proximity wireless transfer technology.

In combination and applied to mobile devices, such as smartphones, they achieve a maximum data transfer rate of 375Mbps.

TransferJet is a low-power, high-speed communication standard, and is expected to find acceptance because of its simple approach to allows high-speed communications between electronic devices in close proximity.

Toshiba's small module, only 4.8mm x 4.8mm x 1.0mm, and ultra-thin FPC coupler, only 0.12mm thick, achieve a maximum physical layer transmission rate of 522Mbps (effective data transfer rate of 375Mbps). Module miniaturization was realized by employing 3D integration technology to embed a TransferJet-compatible LSI in the module substrate.

A potential problem with small, thin modules formed with 3D integration technology is a parasitic capacitance increase that often degrades performance. The frequency response of TransferJet is particularly sensitive to this, as has a wide signal bandwidth, 560MHz. Toshiba solved these potential problems with the design of the module structure and tuning transmission signals? waveforms inside the LSI.

The new FPC coupler is fabricated with molecular bonding technology, which secures enough adhesion of FPC by covalent bond of a thin molecular layer. The coupler is electrically evaluated with the module and Toshiba says excellent transmission RF signals have been observed. It has quarter thickness of conventional couplers.

The module is now ready for sample production and the coupler will be ready for sample production this month.




Previous
Next
Chinese Windows XP Users To Get Security Support After April 8        All News        Android Led Tablet Sales In 2013
Google, Samsung Concerned About Microsoft-Nokia deal: report     Mobiles News      Apple Rolls Out CarPlay Giving Drivers iPhone Voice Control Options

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba PC Business Not Affected By Company's Restructuring
Toshiba Develops High-Speed MTJ Element for Non-Volatile STT-MRAM For 2X nm Generation Transistors
Toshiba Develops Circuit Technology for Small Area Non-volatile FPGAs
New Imaging Technique Can Simultaneously Acquire a Color Image and Depth Map from a Single Image Taken with a Monocular Camera
New Toshiba 8TB X300 Hard Disk Drive Released
Fujitsu, Vaio, Toshiba, Abandon PC Merger Plans
New Toshiba Q300 And Q300 Pro Family Of SSDs Launch With 15nm TLC Flash Memory
Toshiba Recalls Laptop Computer Battery Packs Due to Burn and Fire Hazards
Toshiba Invests In New Memory Fabrication Facility, Sells 5.9 billion Assets And its Home Appliance Business
Canon to Buy Toshiba Medical For About $6bn
Toshiba HK4 Series SSDs Now Available
Toshiba Cancels Launch of Wearvue TG-1 Wearable Device

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .