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Monday, March 03, 2014
Toshiba Develops TransferJet-Compatible 3D-Integrated Ultra-Small Module
Toshiba has developed a very small wireless communication module and a thin flexible printed circuit (FPC) coupler compatible with TransferJet, the close-proximity wireless transfer technology.
In combination and applied to mobile devices, such as smartphones, they achieve a maximum data transfer rate of 375Mbps.
TransferJet is a low-power, high-speed communication standard, and is expected to find acceptance because of its simple approach to allows high-speed communications between electronic devices in close proximity.
Toshiba's small module, only 4.8mm x 4.8mm x 1.0mm, and ultra-thin FPC coupler, only 0.12mm thick, achieve a maximum physical layer transmission rate of 522Mbps (effective data transfer rate of 375Mbps). Module miniaturization was realized by employing 3D integration technology to embed a TransferJet-compatible LSI in the module substrate.
A potential problem with small, thin modules formed with 3D integration technology is a parasitic capacitance increase that often degrades performance. The frequency response of TransferJet is particularly sensitive to this, as has a wide signal bandwidth, 560MHz. Toshiba solved these potential problems with the design of the module structure and tuning transmission signals? waveforms inside the LSI.
The new FPC coupler is fabricated with molecular bonding technology, which secures enough adhesion of FPC by covalent bond of a thin molecular layer. The coupler is electrically evaluated with the module and Toshiba says excellent transmission RF signals have been observed. It has quarter thickness of conventional couplers.
The module is now ready for sample production and the coupler will be ready for sample production this month.