Tuesday, April 24, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
First-Quarter Lobbying Expenditures: Google, AT&T, Comcast and Comcast Remain Top Spenders
Samsung Launches Six Original Series on Samsung VR Video Service on Gear VR
Facebook Says Users Are Not Products, the Social Network Is
European Regulators Investigate Apple's Proposed Acquisition of Shazam
Amazon is Working on Home Robots: report
7nm Volume Production to Fuel TSMC's Profits This Year
Toshiba Weighs Memory Chip Unit Options
Google Chat Launches to compete with Apple's iMessage
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, October 31, 2013
Toshiba Launches New 19nm Embedded NAND Flash Memory Modules


Toshiba launches a new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Toshiba's new 32-gigabyte (GB) embedded device integrates four 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's 19nm second generation process technology and a dedicated controller into a small package measuring 11.5 x 13 x 1.0mm. It is compliant with JEDEC e・MMCTM Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.

The JEDEC e•MMCTM V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software.

Toshiba will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications.

Product Name

THGBMBG8D4KBAIR

THGBMBG7D2KBAIL

Interface

JEDEC e•MMCV5.0 standard

HS-MMC interface

Capacity

32GB

16GB

Power Supply Voltage

2.7~3.6V  (Memory core)

1.7V~1.95V / 2.7V~3.6V  (Interface)

Bus Width

x1 / x4 / x8

Write Speed

90MB per sec.(Sequential/HS400 Mode)

50MB per sec.(Sequential/HS400 Mode)

Read Speed

270MB per sec.(Sequential/HS400 Mode)

270MB per sec.(Sequential/HS400 Mode)

Temperature Range

-25degrees to +85degees Celsius

Package

153Ball FBGA

11.5x13x1.0mm

153Ball FBGA

11.5x13x0.8mm





Previous
Next
HTC to Appeal U.K. Patent Ruling        All News        Mobile Ads Push Facebook's Revenue
VIA Launches Springboard Platform For Android and Linux Devices     PC Parts News      Intel To Make Altera's First 64-bit ARM Chip

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Weighs Memory Chip Unit Options
Toshiba Releases New Surveillance, Video Streaming Laptop and Desktop Hard Drives
China Opposes SK hynix-Toshiba Deal
Toshiba Delays Memory Chip Unit Sale
Samsung Breaks Ground in New Memory fab Line in Xian
Toshiba Memory to Make New Investment in Production Equipment for Fab 6 at Yokkaichi Operation
Toshiba Launches KumoScale NVM Express over Fabrics Storage Software for Cloud Infrastructures
Toshiba Adds 64-layer BiCS CD5, XD5 and HK6-DC Models to Data Center SSD Lineup
Samsung Expands Xian Flash Memory Plant
Western Digital to Inject $4.6bn in Toshiba Memory
Toshiba Completes Transfer of its TV Business to Chinese Hisense Group
Toshiba Releases 2TB Hard Disk Drive for Notebooks

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .