Monday, June 26, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Facebook, Microsoft, Twitter and YouTube Team Up To Counter Terrorism
Nintendo Super NES Classic Edition Coming in September for $80
EU Set to Announce Antitrust Fine Against Google
Microsoft Patent Describes Plan to Stop Thieves Stealing Laptops
Nokia 6 Smartphone Will be Available on Amazon
Toshiba Chip-Unit Final Agreement Said to be Delayed, WD Opposes Participation of SK Hynix
Smart Switch App Lets you Move Everything from your Old Phone to a Newer Galaxy Device
HERE and Pioneer Partner on Global Map Solutions
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, October 31, 2013
Toshiba Launches New 19nm Embedded NAND Flash Memory Modules


Toshiba launches a new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Toshiba's new 32-gigabyte (GB) embedded device integrates four 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's 19nm second generation process technology and a dedicated controller into a small package measuring 11.5 x 13 x 1.0mm. It is compliant with JEDEC e・MMCTM Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.

The JEDEC e•MMCTM V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software.

Toshiba will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications.

Product Name

THGBMBG8D4KBAIR

THGBMBG7D2KBAIL

Interface

JEDEC e•MMCV5.0 standard

HS-MMC interface

Capacity

32GB

16GB

Power Supply Voltage

2.7~3.6V  (Memory core)

1.7V~1.95V / 2.7V~3.6V  (Interface)

Bus Width

x1 / x4 / x8

Write Speed

90MB per sec.(Sequential/HS400 Mode)

50MB per sec.(Sequential/HS400 Mode)

Read Speed

270MB per sec.(Sequential/HS400 Mode)

270MB per sec.(Sequential/HS400 Mode)

Temperature Range

-25degrees to +85degees Celsius

Package

153Ball FBGA

11.5x13x1.0mm

153Ball FBGA

11.5x13x0.8mm





Previous
Next
HTC to Appeal U.K. Patent Ruling        All News        Mobile Ads Push Facebook's Revenue
VIA Launches Springboard Platform For Android and Linux Devices     PC Parts News      Intel To Make Altera's First 64-bit ARM Chip

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Chip-Unit Final Agreement Said to be Delayed, WD Opposes Participation of SK Hynix
Toshiba Open to Further Talks With Western Digital About Chip Unit Sale
Japan-led Consortium Wins Toshiba Memory Bidding
Toshiba Applies Spintronics Technology to Strain-gauge Sensor Element to Boost Sensitivity
Samsung Ramps up 64-Layer V-NAND Memory Production
Western Digital's SanDisk Subsidiaries Seek Injunctive Relief Against Toshiba in the Superior Court of California
Toshiba Faces New Lawsuit Over Accounting Scandal
Toshiba Announces Next Generation 15,000rpm AL14SX HDD
Apple, Dell, Kingston, Amazon, Could Join Foxconn In Bid for Toshiba Chip Business
Western Digital Said to Sweeten Offer For Toshiba's Memory Unit
Foxconn, Apple and Amazon to join Bid for Toshiba Chip Business: report
Toshiba Buys Back Stake in Toshiba Memory Corporation to Pressure WD

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .