Thursday, July 31, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Q3 Sales and Profits Down despite Galaxy S5 launch
Apple May lay Off People at Beats: report
Japanese Giants Form JOLED Company To Compete With LG, Samsung
BitTorrent U Secure Online Calling Software Bleep
Fujitsu Semiconductor and ON Semiconductor Announce Foundry Agreement
Kaleidescape Joins the One-Blue Licensing Program
AMD Opteron 64-Bit ARM-Based Developer Kits Now Available
Samsung Galaxy Note 4 Coming On September 3
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, October 31, 2013
Toshiba Launches New 19nm Embedded NAND Flash Memory Modules


Toshiba launches a new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Toshiba's new 32-gigabyte (GB) embedded device integrates four 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's 19nm second generation process technology and a dedicated controller into a small package measuring 11.5 x 13 x 1.0mm. It is compliant with JEDEC e・MMCTM Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.

The JEDEC e•MMCTM V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software.

Toshiba will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications.

Product Name

THGBMBG8D4KBAIR

THGBMBG7D2KBAIL

Interface

JEDEC e•MMCV5.0 standard

HS-MMC interface

Capacity

32GB

16GB

Power Supply Voltage

2.7~3.6V  (Memory core)

1.7V~1.95V / 2.7V~3.6V  (Interface)

Bus Width

x1 / x4 / x8

Write Speed

90MB per sec.(Sequential/HS400 Mode)

50MB per sec.(Sequential/HS400 Mode)

Read Speed

270MB per sec.(Sequential/HS400 Mode)

270MB per sec.(Sequential/HS400 Mode)

Temperature Range

-25degrees to +85degees Celsius

Package

153Ball FBGA

11.5x13x1.0mm

153Ball FBGA

11.5x13x0.8mm





Previous
Next
HTC to Appeal U.K. Patent Ruling        All News        Mobile Ads Push Facebook's Revenue
VIA Launches Springboard Platform For Android and Linux Devices     PC Parts News      Intel To Make Altera's First 64-bit ARM Chip

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba to Release Wearable Biological Sensor
Samsung Maintains Its Global NAND Flash Leadership
Toshiba Introduces Storage Place Solution
Toshiba Brings Suit Against Powerchip for NAND Flash Memory Patent Infringement
NAND Flash Supplier Revenue Falls in First Quarter: TrendForce
Samsung Starts Mass Producing 32-Layer 3D V-NAND Flash Memory, Its 2nd Generation V-NAND Offering
Toshiba Debuts the Satellite Radius Multimode Laptop, New Detachable Notebooks And Windows 8.1 Tablets
Toshiba Announces 5TB, 7,200 RPM Enterprise HDD
SanDisk and Toshiba License Memory Technology IP
Toshiba to Start Vegetable (!) Production at New Factory
Toshiba, SanDisk To Challenge Samsung With Mass Production Of '3D' Memory
Toshiba Launches High Capacity Hard Disk Drives for Surveillance Applications

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .