Friday, April 18, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
HTC Hired Ex-Samsung Marketing Officer
Xbox One Wolrdwide Sales Cross 5 million
Samsung Works With GLOBALFOUNDRIES On 14 nm FinFET Offering
Facebook To Find Nearby Friends
Console Sales Lift AMD's First Quarter Results
LG Expands 'Second Screen' TV Ecosystem With Open-Source SDK
Amazon Announces Kindle Service For Samsung Devices
Nokia Halts Sales Of Lumia 2520 Tablet
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > General Computing > TSMC an...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 17, 2013
TSMC and OIP Partners Deliver 16FinFET and 3D IC Reference Flows


TSMC, the world's largest dedicated semiconductor foundry, today released three silicon-validated Reference Flows within the Open Innovation Platform (OIP) that enable 16FinFET systems-on-chip (SoC) designs and 3D chip stacking packages.

Electronic Design Automation (EDA) vendors collaborated with TSMC to develop and validate all these flows through multiple silicon test vehicles.

The new Reference Flows are:

1. TSMC's 16FinFET Digital Reference Flow, providing technology support to address post-planar design challenges including extraction, quantized pitch placement, low-vdd operation, electromigration, and power management.

2. The 16FinFET Custom Design Reference Flow, offering full custom transistor-level design and verification including analog, mixed-signal, custom digital and memory.

3. The 3D IC Reference Flow, addressing emerging vertical integration challenges with true 3D stacking.

"These Reference Flows give designers immediate access to TSMC's 16FinFET technology and pave the way to 3D IC Through-Transistor-Stacking (TTS) technology," said TSMC Vice President of R&D, Dr. Cliff Hou. "Delivering our most advanced silicon and manufacturing technologies as early and completely as possible to our customers is a major milestone for TSMC and its OIP design ecosystem partners."

The 16FinFET Digital Reference Flow uses the ARM Cortex-A15 multicore processor as a validation vehicle for certification. It helps designers adopt the new technology by addressing FinFET structure related challenges of complex 3D Resistance Capacitance (RC) modeling and quantized device width. In addition, the flow provides methodologies for boosting power, performance and area (PPA) in 16nm, including low-voltage operation analysis, high-resistance layer routing optimization for interconnect resistance minimization, Path-Based Analysis and Graph-Based Analysis correlation to improve timing closure in Automatic Place and Route (APR).

The 16FinFET Custom Design Reference Flow enables custom design by addressing the complexity of 16FinFET process effects and provides methodologies for design compliance in 16nm manufacturing.

The 3D IC process produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device. TSMC's 3D IC Reference Flow addresses integration challenges through 3D stacking. Key features include Through-Transistor-Stacking (TTS) technology; Through Silicon Via (TSV)/microbump and back-side metal routing; TSV-to-TSV coupling extraction.


Previous
Next
ASUS Updates PadFone Infinity With Snapdragon 800, microSD Slot        All News        Nokia Phablet Launch Scheduled For Next Month
Google Buys 240MW Texas Wind Farm     General Computing News      New Logo And Features For Microsoft Bing

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Reports Quarterly Profit
TSMC Enjoys Q4 Profit, Getting Ready For More Efficient Chips
Samsung, TSMC, and Micron Top List of IC Capacity Leaders
Apple Works with TSMC for Manufacturing of A8 Chip: report
TSMC Introduces Its 16nm FinFET Technology
Chipmaker TSMC Reports Increased Earnings
Foundries Spending Big on Capital Equipment
TSMC Outlines Path To 16nm While Costs And Complexity Rise
TSMC To Make Apple's A8 Chip: rumors
Apple's Shift in Chip Manufacturing Strategy Boosts Semiconductor Foundry Business
Big Changes Reported To 1H13 Top 20 Semiconductor Supplier Ranking
TSMC Reports Q2 Profit Up

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .