Wednesday, July 30, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Microsoft Releases The Sharks Cove, A Raspberry Pi Alternative
EA Access for Xbox One Now Available
NVIDIA Rolls Out the GeForce 340.52 WHQL Driver
BlackBerry Strengthens Its Mobile Security Portfolio With The Acquisition of Secusmart
IBM, ACS And AT&T Claim Breakthrough In Elastic Cloud-to Cloud Networking
HP Says Internet of Things Devices Are Vulnerable to Attack
China Starts Anti-monopoly Investigation On Microsoft
Apple's MacBook Pros Now Come With Faster processors And More Memory
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > General Computing > TSMC an...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 17, 2013
TSMC and OIP Partners Deliver 16FinFET and 3D IC Reference Flows


TSMC, the world's largest dedicated semiconductor foundry, today released three silicon-validated Reference Flows within the Open Innovation Platform (OIP) that enable 16FinFET systems-on-chip (SoC) designs and 3D chip stacking packages.

Electronic Design Automation (EDA) vendors collaborated with TSMC to develop and validate all these flows through multiple silicon test vehicles.

The new Reference Flows are:

1. TSMC's 16FinFET Digital Reference Flow, providing technology support to address post-planar design challenges including extraction, quantized pitch placement, low-vdd operation, electromigration, and power management.

2. The 16FinFET Custom Design Reference Flow, offering full custom transistor-level design and verification including analog, mixed-signal, custom digital and memory.

3. The 3D IC Reference Flow, addressing emerging vertical integration challenges with true 3D stacking.

"These Reference Flows give designers immediate access to TSMC's 16FinFET technology and pave the way to 3D IC Through-Transistor-Stacking (TTS) technology," said TSMC Vice President of R&D, Dr. Cliff Hou. "Delivering our most advanced silicon and manufacturing technologies as early and completely as possible to our customers is a major milestone for TSMC and its OIP design ecosystem partners."

The 16FinFET Digital Reference Flow uses the ARM Cortex-A15 multicore processor as a validation vehicle for certification. It helps designers adopt the new technology by addressing FinFET structure related challenges of complex 3D Resistance Capacitance (RC) modeling and quantized device width. In addition, the flow provides methodologies for boosting power, performance and area (PPA) in 16nm, including low-voltage operation analysis, high-resistance layer routing optimization for interconnect resistance minimization, Path-Based Analysis and Graph-Based Analysis correlation to improve timing closure in Automatic Place and Route (APR).

The 16FinFET Custom Design Reference Flow enables custom design by addressing the complexity of 16FinFET process effects and provides methodologies for design compliance in 16nm manufacturing.

The 3D IC process produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device. TSMC's 3D IC Reference Flow addresses integration challenges through 3D stacking. Key features include Through-Transistor-Stacking (TTS) technology; Through Silicon Via (TSV)/microbump and back-side metal routing; TSV-to-TSV coupling extraction.


Previous
Next
ASUS Updates PadFone Infinity With Snapdragon 800, microSD Slot        All News        Nokia Phablet Launch Scheduled For Next Month
Google Buys 240MW Texas Wind Farm     General Computing News      New Logo And Features For Microsoft Bing

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Losses Chip Orders From Apple, Qualcomm: reports
TSMC Q2 profit Increased, 20nm Chips Start Shipping
TSMC Reports Strong Q2 Sales
TSMC Aims At 10nm Chip Production By 2016
TSMC Reports Quarterly Profit
TSMC Enjoys Q4 Profit, Getting Ready For More Efficient Chips
Samsung, TSMC, and Micron Top List of IC Capacity Leaders
Apple Works with TSMC for Manufacturing of A8 Chip: report
TSMC Introduces Its 16nm FinFET Technology
Chipmaker TSMC Reports Increased Earnings
Foundries Spending Big on Capital Equipment
TSMC Outlines Path To 16nm While Costs And Complexity Rise

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .