Monday, September 15, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Open Source Conference Kicks off Tuesday
Nokia 130 Coming To Stores
LG G3 Stylus Debuts
Netflix Now Available In France
First Low-cost Android One Phone Unveiled
Panasonic Showcases Optimized Workflow at IBC 2014
DVB Demonstrates New Platforms To Deliver UHD and HD Services
JPMorgan Servers Hacked in June
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, July 02, 2013
Toshiba And Sandisk Expand Semiconductor Fabrication Facility


Toshiba ans Sandisk will expand their No. 5 semiconductor joint venture wafer fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories.

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year.

The companies expect to use phase two of Fab 5 primarily for technology transitions of existing Yokkaichi wafer capacity. The new cleanroom will provide the space needed for additional equipment required for transitioning the wafer capacity in Fab 3, Fab 4 and phase one of Fab 5, to next generation 2D NAND technologies and to early generations of 3D NAND technology.



Fab 5 will have an earthquake absorbing structure and is designed to minimize environmental impact. Extensive use of LED lighting throughout the facility and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to reduce CO2 emissions to a level 13 percent lower than for Fab 4.

Fab 5 phase 2 will have an automated product transportation system and quake-absorbing structure and will be designed to minimize environmental loads. Deployment of LED lighting and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to cut CO2 emissions by 13% compared with Fab 4.


Previous
Next
Apple Applies iWatch Trademark Filings in Taiwan, Mexico        All News        Sharp to Introduce 4K Touchscreen LCD Monitor
DivX HEVC Decoder Released     General Computing News      Microsoft to Retire TechNet Subscription Service

Get RSS feed Easy Print E-Mail this Message

Related News
SanDisk Premieres 512GB SD Card, New CFast Memory Cards
Toshiba 2014 4K UHD Models Now Available
Toshiba and SanDisk Celebrate the Opening of the Second Phase of Fab 5 and Start Construction of New Fab 2 Semiconductor Fabrication Facility
Toshiba Achieves world's Highest Rate of Quantum Encryption Key Data Distribution
Logitech Unveils Keyboard Designed For Your Computer, Smartphone and Tablet
Toshiba at IFA 2014
NAND Flash Market to Grow in 2015
SanDisk Releases The TLC-based Ultra II SSD
New SanDisk Ultra Fit Flash Drive Promises Exceptionally High Performance
Toshiba Responds To Samsung, Introduces 3-Bit SSD
Toshiba's New Wearable Wristband Fitness Tracker Runs Two Weeks without Recharging
Toshiba Launches 8 Megapixel CMOS Image Sensor for Smartphones

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .