Saturday, November 25, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Websites Track Everything You Do, Researchers Found
Atomic Switches Pave The Way For Neuromorphic Chipsets
Samsung to Showcase Large Micro LED TV at CES: report
Samsung Foundry in Advanced Discussions With New Customers for 7nm Chips
Tesla Finished Installing the World's Largest Mega-battery in Australia Within 100 Days
Apple Applies for Patent on Foldable Display
HP Patches Code execution Bug in Enterprise Printers
YouTube Takes More Steps to Tackle Down Videos Inappropriate for Minors
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, April 02, 2013
Toshiba Unveils Thinnest Camera Module With 13 Mega Pixel Image Sensor


Toshiba today announced the industry's thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel (MP), imaging ideal for ultra-thin smartphones and tablet devices.

The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry's lowest profile at just 4.7 mm in height.

Achieving today's high-resolution CMOS image sensors requires a larger optical size for corresponding lenses which results in a thicker camera module and a bulkier mobile device. The conventional method for lowering the camera module height is to modify the optical lens design which becomes problematic due to resolution drop around the corners of the image area. The TCM9930MD, however, resolves this drop in resolution with the use of the image pre-processing LSI (companion) chip that provides distortion correction and performs image resolution reconstruction. Additionally, the TCM9930MD achieves its low profile by using a flip-chip structure for the image sensor. Toshiba opted to use flip-chip packaging because it allows for a large number of interconnects, with shorter distances than wire, which greatly reduces assembling area and package height.

Sample pricing for the TCM9930MD camera module is set at $80 (U.S.). The TCM9930MD is expected to be available in sample quantities by May 2013.


Previous
Next
Intel To Make Chips For Cisco        All News        Court Rules MP3 Resale Violates Copyright Law
HTC One Arrives At AT&T     Mobiles News      Android, Sprint and Samsung Increased Share In Early 2013

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba's Board Approves $5 billion Injection to Stay Listed
Asus Could Buy Toshiba's PC Business
Toshiba Sells TV, Visual Solutions Unit to Chinese Hisense
Toshiba's Profit Jumps on Strong Memory Demand
Toshiba's Shareholders Approve Sale of Toshiba Memory
Sony Releases 7.42 Effective Megapixel Stacked CMOS Image Sensor for Automotive Cameras
New Toshiba TR200 3D NAND SSDs Offer an Affordable Alternative to Hard Disks
Toshiba to Further Invest in Production Equipment for Fab 6 at Yokkaichi Operations
Samsung Takes on Sony With New ICOCELL Image Sensors for Smartphones
Western Digital Provides Its Aspect on Latest Developments Related to the Sandisk JV with Toshiba
Toshiba Signs Deal to Sell Chip Unit to Bain-led Group
SK Hynix to Invest 395 billion yen in Toshiba chip unit

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .