Thursday, July 20, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
TSMC InFO packaging Enters Second Generation
Samsung Display to Provide OLED panels to Xiaomi
Qualcomm Profit Forecast Disappoints Amid Apple Legal Battles
Google Embrace News Feed on Mobile With Personalized 'Feed'
iPhone Manufacturers Accuse Qualcomm of Antitrust Violations
Toshiba Resumed Blocking Western Digital Access to JV Database
Samsung kicks off English-language Bixby Voice Service
Microsoft Joins Baidu's Autonomous Driving Project
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, April 02, 2013
Toshiba Unveils Thinnest Camera Module With 13 Mega Pixel Image Sensor


Toshiba today announced the industry's thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel (MP), imaging ideal for ultra-thin smartphones and tablet devices.

The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the industry's lowest profile at just 4.7 mm in height.

Achieving today's high-resolution CMOS image sensors requires a larger optical size for corresponding lenses which results in a thicker camera module and a bulkier mobile device. The conventional method for lowering the camera module height is to modify the optical lens design which becomes problematic due to resolution drop around the corners of the image area. The TCM9930MD, however, resolves this drop in resolution with the use of the image pre-processing LSI (companion) chip that provides distortion correction and performs image resolution reconstruction. Additionally, the TCM9930MD achieves its low profile by using a flip-chip structure for the image sensor. Toshiba opted to use flip-chip packaging because it allows for a large number of interconnects, with shorter distances than wire, which greatly reduces assembling area and package height.

Sample pricing for the TCM9930MD camera module is set at $80 (U.S.). The TCM9930MD is expected to be available in sample quantities by May 2013.


Previous
Next
Intel To Make Chips For Cisco        All News        Court Rules MP3 Resale Violates Copyright Law
HTC One Arrives At AT&T     Mobiles News      Android, Sprint and Samsung Increased Share In Early 2013

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Resumed Blocking Western Digital Access to JV Database
Court Says Western Digital Should Have Access Toshiba's Technical Databases
Toshiba in Talks with Western Digital, Foxconn Over Memory Unit Sale
Western Digital Responds to Toshiba's Actions
Toshiba Delays Chip Unit Deal, Sues Western Digital
Samsung Launches ISOCELL Image Sensor Brand
New Sony 20MP CMOS Image Sensor Released
Western Digital Resubmits Bid for Toshiba Chip Unit
Toshiba Chip-Unit Final Agreement Said to be Delayed, WD Opposes Participation of SK Hynix
Toshiba Open to Further Talks With Western Digital About Chip Unit Sale
Japan-led Consortium Wins Toshiba Memory Bidding
Toshiba Applies Spintronics Technology to Strain-gauge Sensor Element to Boost Sensitivity

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .