Thursday, December 18, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Facebook And Android Top Digital Trends For 2014
Your Next Car Could Have Android Inside
North Korea Linked To Recent Sony Hacking
Sony Global Education Established
CEA and Japan Audio Society to Jointly Promote Hi-Res Audio
Intel, IBM Follow Different Strategies On 14nm FinFET
Toshiba Announces 6TB Enterprise Capacity HDD Models
WebOS 2.0 Smart TV Platfom To Debut At CES
Active Discussions
Windows xp
Will there be any trade in scheme for the coming PSP Go?
Hello, Glad to be Aboard!!!
Best optical drive for ripping CD's? My LG 4163B is mediocre.
Hi All!
cdrw trouble
CDR for car Sat Nav
DVD/DL for Optiarc 7191S at 8X
 Home > News > General Computing > STMicro...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, March 26, 2013
STMicroelectronics Gets Funding By The European Investment Bank


STMicroelectronics has signed a new Euro 350 million loan agreement with the European Investment Bank (EIB).

The facility, which has not yet been drawn by ST, is also available in the US$ equivalent amount and has an option for disbursement until September 2014 with final maturity eight years after disbursement.

This new facility supports ST's activities in R&D related to the design and realization of the next generation of technologies and electronic devices for applications in Power, MEMS, Microcontrollers, Advanced Analog and Healthcare. This includes the full cycle from technology R&D and product development to application solutions that include software development and systems integration. These activities are mainly carried out in ST?s Italian sites of Agrate Brianza, Castelletto and Catania.

Furthermore, on March 17th, 2013, ST repaid with available cash the residual Euro 350 million floating-rate senior bonds outstanding with a principal amount of Euro 500 million at issuance. ST's capital structure, already supported by a net cash position of about US$ 1.19 billion at the end of Q4 2012, and existing committed credit lines for about US$ 490 million, has been further strengthened by this new credit facility from the EIB.


Previous
Next
Nokia Unveils Developer Program for Asha        All News        NVIDIA Responds To Radeon HD 7790 With New Sub-$200 GeForce GTX 650 Ti BOOST GPU
Smart Connected Device Market Crossed 1 Billion Shipments in 2012     General Computing News      Google+ Apps For iPhone and Android Updated

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung and STMicroelectronics Sign Foundry and License Agreement
Charging Mobile Devices from Shutdown PCs
Rambus Signs Agreement with STMicroelectronics
Ericsson and STMicroelectronics To Split Mobile Chip Unit
STMicroelectronics To exit ST-Ericsson
Samsung and STMicroelectronics Team Up On Foundry Services at 32/28nm Technology
STMicroelectronics To Pay $59 million to NXP
New Interface Standard Enables Delivery of Full HD Audio and Video Between Smart Mobile Devices and TVs
STMicroelectronics IC Simplifies Blu-ray Design
Avago Technologies Files Optical Sensor IP Lawsuit Against STMicroelectronics
STMicroelectronics, LG Display, Submits iDP Interface Standard for LCD TVs to VESA
Chip Makers Revise Their Q4 Outlook

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .