Tuesday, February 28, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
MWC 2017: Porsche Design Reveals 2-in-1 with Windows 10
GDC 17: Google Announces New Games For Daydream
Oppo Brings 5X Optical Zoom To Dual-camera Smartphones
Kingston Ships 2TB USB Flash Drive
One-Blue Lowers Blu-ray Licensing Fees
Twitch to Sell Video Games on Streaming Site
Personal Computing Devices Outlook Remains Mildly Negative, Detachable Tablets And Convertible Notebooks See Growth
Gionee Launch New Selfie-focused A1 And A1 Plus Smartphones
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 01, 2013
Toshiba Showcased 128Gb 19nm NAND Flash At Nano Tech


Toshiba showcased a 300mm wafer that had 128-Gbit NAND flash memory chips and was made by using 19nm process technology at "nano tech 2013 ? The 12th International Nanotechnology Exhibition & Conference", the world's biggest exhibition of nanotechnology, that was held at the Tokyo Big Sight from January 30 to February 1.

The company employed the 19nm process technology as well as a 3bit/cell multiple-level cell (MLC) technology. Compared to 2bit/cell MLC flash, the 3bit/cell MLC flash chips can be rewritten fewer times, meaning that the new flash is mostly suited for USB flash drives or flash cards, where absolute costs and density are the most important thing, and the performance and endurance are still adequate.

Toshiba claims that its 19nm process technology offers the same reliability as its previous 24nm process. The Japanese company used a structure that separates floating gates with air gaps to reduce the interference between memory cells.

Toshiba has been also working on the reduction of package thickness by stacking NAND chips in several layers. The company has managed to maintain a slim package for its 128-Gbyte memory by staking 16 layers of 30µm-thick 64-Gbit chips using a wire bonding technology.


Previous
Next
Google Works With EU To Settle Antitrust Probe        All News        OCZ Technology Provides Estimated Financial Information
New 180GB Capacity Added to Intel SSD 335 Series     PC Parts News      OCZ Technology Provides Estimated Financial Information

Get RSS feed Easy Print E-Mail this Message

Related News
Western Digital Releases New iNAND 7350 Storage Solution Built on 3D NAND
Toshiba Starts Sampling 64-Layer, 512-gigabit 3D Flash Memory
Toshiba Books $6.3 Billion Writedown, Chairman Resigns
Toshiba Starts Construction of Fab 6 at Yokkaichi, Japan
Toshiba Announces First MN Series HDDs
SK hynix Bids for Stake in Toshiba's Memory Chip Business
Western Digital Introduces First 512 Gigabit 64-Layer 3D NAND Chip
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6
Toshiba Faces New Lawsuits Over 2015 Accounting Scandal
Toshiba to Sell Part Of Its of Chip Unit
Toshiba May Spin Off Its Semiconductor Business
CES 2017: Toshiba Debuts Portege X20W 2-in-1 Convertible

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .