Tuesday, January 23, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Intel: Stop Installing Security Patches Until Further Notice
Microsoft Takes On Chromebooks With Education Windows 10 Devices starting at $189
Opera Mobile Browsers Introduce Bitcoin Mining Protection
Amazon Store Let's You Walk Away Without Checking out
Facebook Admits it Could Harm Democracy
Facebook to Open Digital Training Hubs in Europe
U.S. ITC to Probe Samsung, SK Hynix, Lenovo Over SSDs
LG Won't Showcase New G Series Smartphone at MWC
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 01, 2013
Toshiba Showcased 128Gb 19nm NAND Flash At Nano Tech


Toshiba showcased a 300mm wafer that had 128-Gbit NAND flash memory chips and was made by using 19nm process technology at "nano tech 2013 ? The 12th International Nanotechnology Exhibition & Conference", the world's biggest exhibition of nanotechnology, that was held at the Tokyo Big Sight from January 30 to February 1.

The company employed the 19nm process technology as well as a 3bit/cell multiple-level cell (MLC) technology. Compared to 2bit/cell MLC flash, the 3bit/cell MLC flash chips can be rewritten fewer times, meaning that the new flash is mostly suited for USB flash drives or flash cards, where absolute costs and density are the most important thing, and the performance and endurance are still adequate.

Toshiba claims that its 19nm process technology offers the same reliability as its previous 24nm process. The Japanese company used a structure that separates floating gates with air gaps to reduce the interference between memory cells.

Toshiba has been also working on the reduction of package thickness by stacking NAND chips in several layers. The company has managed to maintain a slim package for its 128-Gbyte memory by staking 16 layers of 30µm-thick 64-Gbit chips using a wire bonding technology.


Previous
Next
Google Works With EU To Settle Antitrust Probe        All News        OCZ Technology Provides Estimated Financial Information
New 180GB Capacity Added to Intel SSD 335 Series     PC Parts News      OCZ Technology Provides Estimated Financial Information

Get RSS feed Easy Print E-Mail this Message

Related News
Tsinghua Unigroup May License 3D NAND flash Technology From Intel
Toshiba Reveals Fresh Canvio Portable Hard Drive Models
Micron and Intel to Limit Their NAND Memory Joint Development Program
Toshiba Officially Unveils Mainstream RC100 NVMe SSD Series
Struggling Toshiba Sells Westinghouse to Brookfield
Toshiba Introduces the Symbio Smart Home Solution With Alexa Support
Toshiba to Unveil New RC100 NVMe and Portable XS700 SSDs at CES 2018
Toshiba to Prepare New Semiconductor Fabrication Facility
Toshiba Introduces New AL15SE 10,500rpm Enterprise Performance HDD
Toshiba and Western Digital Reach Settlement, Agree to Strengthen Flash Memory Collaboration
Toshiba Unveils Embedded NAND Flash Memory Products for Automotive Applications
Toshiba and Western Digital Close to Agreement Over Memory Chip Sale

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .