Wednesday, May 25, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Huawei Sues Samsung Over Mobile Patents
Toyota Is Investing In Uber
Google Enhances Ads For Mobile Devices
LG G5 "Friends" LG CAM Plus, LG 360 CAM, LG 360 VR, LG TONE Devices Launch In US
Twitter Photos, videos And Names in Reply Tweets Will No Longer Count Toward 140-character Limit
Samsung Expands 750 EVO SSD With Availability and Increases Capacity to 500GB
Google's Paris Offices Raided
OCZ RD400 NVMe SSD Series Released
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Intel F...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, December 11, 2012
Intel Focuses On Smaller, System-On-Chips For Mobile Devices


Intel on Monday said it is putting more emphasis now on system-on-a-chip technology, which is used widely in smartphones and tablets, where the company has largely been absent.

At the International Electron Devices conference in San Francisco on Monday, Intel reported on the progress of its technology for 22nm SoCs, saying that the technology will be ready for high volume manufacturing in 2013.

Mark Bohr, head of Intel's process technology development group, said Intel?s 22-nm FinFET process is cost effective, contradicting report it is 30 to 40 percent more expensive than TSMC's 28nm planar process.

Intel is applying its 22-nanometer "Tri-Gate" 3D chip technology to SoCs for the first time. Intel said its 22nm 3D process variation for SoCs outperforms its own 32nm planar process by 20 to 65 percent and covers four orders of magnitude in leakage current. Specifically, the 22nm process provides 51~56% improvements in high voltage performance used for fast interfaces such Ethernet, HDMI and PCI Express.

The new 22nm process supports high and standard performance options as well as low and ultra low power ones. It also includes SRAM designs optimized for density, power and performance some of which now hit 2.6 GHz at 1V, up from 1.8 GHz at 32 nm.

Intel's current mobile SoCs are manufactured at 32 nm. Those SoCs include the Clover Trail chip being used in Windows 8 tablets and the Medfield chips adopted for Motorola and Lenovo smartphones, among other devices. Intel's rival in the mobile chip market Qualcomm makes its top-end SoCs at 28 nm and Nvidia uses 40 nm technology.

Intel already makes PC processors at 22 nm, but SoCs pack more features onto one piece of silicon, making 22nm manufacturing more complicated.

According to current projections, 14nm wafers made with today?s 193-nm immersion lithography could be be significantly more expensive than 28nm parts. The next-generation lithography (EUV) would cut some costs as soon as the EUV lithography tools are ready by 2014, but still the new wafers are expected to me exoensive.

Commenting on the the cost of future 14nm wafers, Bohr said that although cost per wafer has always gone up each generation, the increase in transistor density at 14nm brings the cost per transistor down.

Seperately, IBM also talked about its 22-nm process. The company said it is prototyping server processors in a new 3-D ready, 22-nm process technology it hopes will deliver 25 to 35 percent boosts over its 32-nm chips, with server processors running up to 5.5 GHz and others with up to 80 Mbytes embedded DRAM.


Previous
Next
Fujitsu, NTT and NEC To jointly Develop 400Gbps-class Optical Transmissions Technology        All News        Pioneer DDJ-WeGO Controller Now Supports Algoriddm's djay Software
Intel Delivers 6-Watt Server-Class Processor     PC Parts News      G-Technology G-SPEED Storage Solutions Now Ship With 4TB Drives

Get RSS feed Easy Print E-Mail this Message

Related News
Sony Joins Forces with Cogitai to Conduct Research and Development for Artificial Intelligence
Brian Krzanich Outlines Intel's Future Strategy
Microsoft Positions Windows 10 As A Platform for the Intelligence Revolution
Intel To Axe 12,000 Jobs, Focuses On Cloud And Smart, Connected Computing Devicess
Intel Outlines Next Generation of Experiences At 2016 Intel Developers Forum Shenzhen
Intel Packs Altera Arria 10 FPGAs With Xeon E5-2600 v4 Processors
Intel Senior Executives Leaving Company
Intel Introduces Xeon Processor E5-2600 v4 And Its First 3D NAND SSDs
Chinese AI Team To Challenge Google's AlphaGo
Intel To Break From Typical Two-year CPU Release Cycle
New Intel NUC "Skull Canyon" Comes To Change the Game
Google Artificial Intelligence Program Wins Final Game In Go Tournament

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .