Monday, September 01, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Miraisens Showcases Touchable 3D Tech
Nintendo's Figurines Coming Later This Year
ASUS and G.Skill Take Overclocking Records
Korean Researchers Advance Synthesis Process for Graphene Quantum Dots
LG Display Opens LCD Panel Plant in China
Apple Said to Work With Visa, MasterCard on IPhone Wallet
China Gives Microsoft Deadline To Respond To Anti-trust Probe
Samsung Introduces First Curved Soundbar For TVs
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > Mobiles > Qualcom...
Last 7 Days News : SU MO TU WE TH FR SA All News

Sunday, November 18, 2012
Qualcomm Samples Latest Multimode Gobi LTE Modems


Qualcomm has started offering its partners samples of its third generation Qualcomm Gobi LTE chips - the MDM9225 and MDM9625.

The mew chips are the first 28nm chips to contain new LTE and HSPA+ modems, which are faster and use less power than their predecessors.

Qualcomm Gobi LTE chips add cellular connectivity to products, including smartphones, tablets, notebooks, portable hotspots, dongles and more. Gobi allows these devices to connect to the Internet at fast 4G LTE speeds, but they?re also backwards compatible with older 3G and 2G cellular technologies.

Qualcomm Gobi's features include:

First chip with a LTE Advanced Modem
Delivers theoretical speeds of up to 1 gigabits per second.

First chip with a LTE Category 4 Modem
-Delivers theoretical speed of up to 150 megabits per second.

First chip with a 3GPP Release 10 Multicarrier HSPA+ (MC-HSPA+) Modem
-Theoretical speeds up to 84 Mbps

Qualcomm claims that the new Gobi Chips consume less power than their 45nm MDM9x00 and 28nm MDM9x15 predecessors, while their overall size of the board has also been reduced.

The company expects devices with the chips to be available for purchase in 2013.


Previous
Next
Magazine Publishes Next-gen Xbox 720 Details        All News        Samsung Seeks Information On Apple-HTC Deal
Samsung Buys Nokia-branded Shops In Russia     Mobiles News      Sony To Release Flagship Smartphone At CES 2013

Get RSS feed Easy Print E-Mail this Message

Related News
Europer To Probe Qualcomm: report
Qualcomm's Profit Hurt by Dispute Over China Royalties
Samsung To Manufacture Qualcomm's Mobile Application Processors
Qualcomm To Make Snapdragon chips In China
Qualcomm Acquires WiGig Leader Wilocity
Rambus Signs License Agreement with Qualcomm
Qualcomm Introduces Small Cell SoC For Access Points
LG U+ Demonstrates 300MBps Wireless Network in Seoul
Qualcomm Demonstrates Live LTE-TDD Broadcast In China
Qualcomm Establishes Retail Solutions Subsidiary
Qualcomm Reports Less Than Expected 2Q Revenue
Qualcomm Introduces New Snapdragon 810 and 808 64-bit Processors

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .