Sunday, May 01, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
You Can No Longer Use Google In Cortana searches
HP Releases New Chromebook for Home and Office
AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture
Google's Pichai Sees the End of Computers
Amazon Reports Strong Quarter
Sony Reports Loss But PlayStation Keeps Performing Well
Japan Display Showcase The Latest In Display Technologies In SID DISPLAY WEEK 2016
Strong Galaxy S7 Sales Keep Samsung's Profit High
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC To...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, September 05, 2012
TSMC To Delay Transition To 450-mm Wafers


Taiwan Semiconductor Manufacturing Co. (TSMC) will start using 450-millimeter wafers to build its processors in 2018, following delays in the development of the new technology.

J.K. Wang, Taiwan Semiconductor Manufacturing Co.?s vice president for operations/300mm fabs, said the company will begin volume production of chips on 450mm silicon wafers in 2018, offering FinFET transistor technology at 10nm node. He noted that TSMC has completed its planning for deploying 450mm wafer production.

The company's vice president for research and development, Burn Lin, pointed out that TSMC will begin volume production of FinFET transistors at 20nm process and is on the track to deploy 16nm FinFET process. In addition to ultraviolet lithography, Lin said that TSMC is also considering multi e-beam lithography technology for its 10nm FinFET process. He pointed out that TSMC will use the legacy immersion lithography technology on its 10nm and 16nm transistors as EUV is still immature. However, transistors smaller than 10nm will use next-generation lithography technology.

Intel, TSMC, Samsung, IBM, and GlobalFoundry have formed an alliance to push for 450mm technology.

Currently, chip makers are using silicon wafers at the 300-mm size to build their processors. Upgrading to the 450-mm level would allow companies to produce more chips from each wafer, as the 450-mm wafers have 2.5 times more surface area.

Industry has been slow to move forward to 450-mm wafer manufacturing, as billions of dollars are needed to invest in building the tools and factories to produce the wafers.


Previous
Next
Singulus Sees Growth Oportunities Despite Slow Economy        All News        Intel To Present 4th Gen "Haswell" Chips at IDF
Lenovo Buys CCE     General Computing News      Windows Server 2012 Released

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
TSMC To Build 12-inch Fab In China
ARM and TSMC To Collaborate on 7nm FinFET Process Technology
Samsung Lost iPhone 7 Chip Contract
TSMC Says Recent Earthquake Damaged Wafers
TSMC Wins Exclusive Chip Contract For Next iPhone: report
Chip Makers Differientate In terms Of Equipment Investments
Taiwan Earthquake Temporarily Suspended TSMC's And UMC's Production
TSMC Confident That It Will Lead The 10nm Foundry Segment
TSMC Has Started Woking On 5nm Manufacturing Process
TSMC To Open 12-inch Wafer Fab and Design Service Center in China

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .