Tuesday, February 21, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New Snapdragon X20 LTE Modem Is Paving the Way for 5G
TrendForce Sees Three New iPhones Coming This Year, Including AMOLED Model With 3D Facial Recognition Function
New LG X400 Smartphone Launches In Korea
Samsung to Exhibit New VR Projects at Mobile World Congress 2017
Intel Optane Memory Products Will Run Only On Systems With 7th Generation Intel Processors
Google, Bing Agree to Help U.K. Fight Pirate Sites
Researchers Create Printed ICs that Can Stretch
SK Telecom to Unveil Live Streaming Platform for 360 VR at MWC 2017
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Japanes...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 24, 2012
Japanese Companies Develop LSI IP For For Multi-standard Modems


NTT DOCOMO, NEC Corp., Panasonic Mobile Communications and Fujitsu Ltd. have jointly developed the software and hardware intellectual property for an (LSI) chip that will enable small modems to support the GSM, W-CDMA, HSPA+ and LTE mobile standards.

The companies have already completed performance evaluation of the LSI engineering sample chip along with all testing required to confirm interconnectivity to the mobile networks of major vendors.

The single chip solution for modems reduces power consumption by about 20% during both communication and stand-by, as well as decreases the production cost for mobile devices.

All mobile broadband standards supported by the chip meet 3rd Generation Partnership Project (3GPP) specifications. The LTE standard supports FDD (Frequency Division Duplexing) mode adopted by DOCOMO and TDD (Time Division Duplexing) mode expected to be adopted for LTE networks in China and other markets.

The four partners, in addition to other layers in the mobile technology field, aim to commercialize the chip in Japan and other countries as quickly as possible in response to market demands for smaller and more affordable mobile devices.

The group additionally plans to pursue development of a multi-standard chip that is also compliant with the LTE-Advanced next-generation transmission standard.


Previous
Next
Q4 Graphics Shipments Decreased Over Last Quarter, Increased Over Last Year        All News        Visual Studio 11 Beta and .NET Framework 4.5 Beta Make Software Development Faster
Dropbox Unveils Photo Upload Feature For Mobiles     Mobiles News      T-Mobile USA To Offer 4G LTE in US Next Year

Get RSS feed Easy Print E-Mail this Message

Related News
Telstra Launches First Commercial Gigabit LTE Network With 150Mbps Upload Speeds
Qualcomm Makes First MulteFire Over-the-Air
Minecraft: Education Edition will launch November 1
NEC Uses Artificial Intelligence to Automatically Detect Unknown Cyber-attacks
Realtek Enters The SSD Controller Market
Hyundai Motor and Cisco To Cooperate On Connected Cars
Samsung Adds Intelligence And Connectivity To Your Car With Samsung Connect Auto
Open Connectivity Foundation Established To Promote Interoperability Of IoT Devices
Intel Completes Acquisition of Altera
Worldwide LTE Report Released
Intel to Deliver Narrow-Band LTE IoT Products Next Year
Intel to Acquire Altera For $16.7 Billion

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .