Monday, March 02, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
MWC: Alcatel Introduces HERO 2+ Phablet And IDOL 3 Smartphone
Google To Launch Wireless Service, Android Pay
HP to Buy Aruba Networks
MWC: Intel Launches New Mobile SoCs, LTE Solution
Jolla Introduces Sailfish OS 2.0
MWC: Fujitsu Develops Smartphone with Iris Authentication
NXP and Freescale Announce $40 Billion Merger
Toshiba Launched TransferJet Adapter for iPhone, iPad and iPod in Europe
Active Discussions
Need serious help!!!!
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
sanyo e6 camera
need help on some cd burning...
 Home > News > PC Parts > Elpida ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, June 27, 2011
Elpida Begins Sample Shipments of DDR3 SDRAM Based on TSV Stacking Technology


Elpida Memory has begun sample shipments of the first DDR3 SDRAM (x32-bit I/O configuration) made using TSV (Through Silicon Via) three-dimensional stack packaging technology.

The sample is a low-power 8-gigabit (1-gigabyte) DDR3 SDRAM assembled in a single package that consists of four 2-gigabit DDR3 SDRAMs fitted to a single interface chip using TSV.

TSV is three-dimensional stack packaging technology, which involves stacking together multiple chips vertically through electrical connections with metal-filled via holes in the SI die. Compared with the existing connection method of wire bonding multiple chips, TSV significantly reduces the length of wires in the semiconductor design to enable faster speeds, lower power consumption, smaller package size and other important chip function advantages.

Elpida began developing TSV in 2004 based on a grant program hosted by the New Energy and Industrial Technology Development Organization (NEDO), a research endeavor founded by the Japanese government. Since then Elpida has continued to develop TSV technology. In 2009 it successfully developed the first TSV DRAM based on stacking together eight 1-gigabit DDR3 SDRAMs.

In the case of notebook PCs, Elpida believes that trial use of its 8-gigabit TSV DRAM samples will demonstrate that compared with systems that use SO-DIMM (Small-outline DIMM), operating power can be reduced by 20% and standby power by 50%. Also, the chip mounting area can be reduced by 70%, the chip height can be decreased and the DIMM socket can be eliminated.

Target applications of the new memory include tablet PCs, thin PCs and other mobile computing systems.

Comparison of Elpida's New 8-gigabit TSV DRAM with a 2-gibabyte SO-DIMM

  2-gigabyte SO-DIMM 8-gigabit (1-gigabyte) TSV x 2
Supply voltage (VDD) 1.5V/1.35V
Bust length 8/4
Bank 8
Cin Cin(mono) x 8 Cin(mono) x 2
Data rate (Mbps) 1600 (1.5V)
1066/1333 (1.35V)
Operating (IDD1) 1.0 0.8 (proportional to SO-DIMM)
Standby (IDD2N) 1.0 0.5 (")
Refresh (IDD5) 1.0 0.5 (")
Mounting area 1.0 0.3 (")



Previous
Next
AMD Released A75 and A55 Llano Chipsets For Desktops        All News        LulzSec Hacking Team Disbanding After Dumping NATO And Forum Data
AMD Released A75 and A55 Llano Chipsets For Desktops     PC Parts News      Scythe Releases Third Version of Mugen Series

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Starts Mass Production Of ePoP Memory for Smartphones
Samsung Now Mass Producing 20-Nanometer 6Gb LPDDR3 Mobile DRAM
ADATA Launches XPG V3 DDR3 Memory For Overclockers
Micron Announces Monolithic 8Gb DDR3 SDRAM
Transcend Releases DDR3 RDIMM Modules For Mac Pro
Samsung Now Mass Producing 4Gb DDR3 Using 20 Nanometer Process Technology
JEDEC Standard Allows Development Of Higher Capacity DDR3 Modules
Elpida Memory Becomes Micron Memory Japan
Micron And Broadcom Collaborate to Solve DRAM Timing Challenge
Kingston Announces 2800 MHz HyperX Predator Memory Kits
G.SKILL Releases DDR3L 2133 MHz 8 GB SO-DIMM Memory Kit
Micron Acquires Elpida, Enhances Its DRAM Portfolio

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .