Friday, July 29, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Alphabet Posts Strong Revenue on Video Market
Games Outweigh Sagging Sensors For Sony
Microsoft To Further Cut Jobs Towards The Final Exit From Phone Business
AMD Radeon RX 470 And RX 460 Are Shipping in Early August
Worldwide Smartphone Volumes Relatively Flat in Q2 2016
Oracle to Buy NetSuite for $9.3 Billion
Samsung and Nestle Collaborate on the Internet of Things and Nutrition
Home Appliance and Home Entertainment Units Help LG's Quarterly Profits
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > TSMC To...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, January 27, 2011
TSMC To Move in Bigger Wafers


Taiwan Semiconductor Manufacturing Company said on Thursday that it plans to have a trial production line using 18-inch wafers ready by 2013 or 2014, in an effort to drive down chip manufacturing costs.

Full production chips using 18-inch wafers would begin in 2015 or 2016.

Bu using using bigger wafers, chip makes can increase their chip production while they are lowering costs.

Last December, Intel also announced plans to use 18-inch wafers in its new Oregan plant, slated for start-up in 2013.

Moving on 18-inch fabs requires significant investments on new tools the factories.


Previous
Next
Ricoh and Microsoft Partner in Cloud Business        All News        Google Previews Android 3.0 Honeycomb Platform
OCZ Announces the Z-Drive R3 PCI-Express SSD with Virtualized Controller Architecture     PC Parts News      AMD Fusion APUs Reduces Carbon Footprint Compared to Previous Generation Products

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC To Follow The Extreme Ultraviolet Approach For 5nm
TSMC 2Q16 Profits Fall, Revenue Grew
TSMC to Boost R&D Spending To Accelerate Development Of More Advanced Chips
ARM And TSMC Validate First Multicore Test Chip Based on 10FinFET Technology
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
TSMC To Build 12-inch Fab In China
ARM and TSMC To Collaborate on 7nm FinFET Process Technology
Samsung Lost iPhone 7 Chip Contract
TSMC Says Recent Earthquake Damaged Wafers
TSMC Wins Exclusive Chip Contract For Next iPhone: report
Chip Makers Differientate In terms Of Equipment Investments

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .