The U.S. International Trade Commission (ITC) has launched an investigation into an allegation that Samsung Electronics infringed on patented wafer packaging technologies of Tessera Advanced Technologies.
The ITC began a probe on October 31 into specific wafer level packaging (WLP) semiconductor devices and products containing them under a Section 337 patent infringement action. WLP refers to a technology that simplifies the packaging of wafers and reduces the volume of products.
The ITC investigation came in response to a complaint recently filed by U.S. semiconductor packaging firm Tessera Advanced Technologies which accused Samsung of violating two patents regarding its WLP technology.
Tessera also asked the ITC to exclude Samsung`s semiconductor chips and Galaxy and Note smartphones that contain such chips from import.
Under the procedure, the ITC will select a judge to handle the case and set the deadline of the probe within 45 days after the initial investigation.